Molex Micro-Fit 3.0 Series Right Angle Surface PCB Header, 10 Contact(s), 3 mm Pitch, 2 Row, Shrouded
- RS-artikelnummer:
- 670-1982
- Tillv. art.nr:
- 43045-1010
- Tillverkare / varumärke:
- Molex
Mängdrabatt möjlig
Antal (1 förpackning med 5 enheter)*
296,24 kr
(exkl. moms)
370,30 kr
(inkl. moms)
GRATIS leverans för online beställningar över 500,00 kr
Sista RS lager
- Slutlig(a) 285 enhet(er), redo att levereras
Enheter | Per enhet | Per förpackning* |
|---|---|---|
| 5 - 95 | 59,248 kr | 296,24 kr |
| 100 - 370 | 29,388 kr | 146,94 kr |
| 375 - 1495 | 25,716 kr | 128,58 kr |
| 1500 - 2995 | 21,46 kr | 107,30 kr |
| 3000 + | 20,922 kr | 104,61 kr |
*vägledande pris
- RS-artikelnummer:
- 670-1982
- Tillv. art.nr:
- 43045-1010
- Tillverkare / varumärke:
- Molex
Specifikationer
Datablad
Lagstiftning och ursprungsland
Produktdetaljer
Hitta liknande produkter genom att välja ett eller flera attribut.
Välj alla | Attribut | Värde |
|---|---|---|
| Brand | Molex | |
| Series | Micro-Fit 3.0 | |
| Product Type | PCB Header | |
| Current | 5A | |
| Pitch | 3mm | |
| Number of Contacts | 10 | |
| Housing Material | Thermoplastic | |
| Number of Rows | 2 | |
| Orientation | Right Angle | |
| Shrouded/Unshrouded | Shrouded | |
| Connector System | Wire-to-Board | |
| Mount Type | Surface | |
| Contact Plating | Gold | |
| Contact Material | Brass | |
| Minimum Operating Temperature | -40°C | |
| Termination Type | Solder | |
| Row Pitch | 3mm | |
| Contact Gender | Male | |
| Maximum Operating Temperature | 125°C | |
| Mating Pin Length | 3mm | |
| Standards/Approvals | No | |
| Voltage | 250 V | |
| Välj alla | ||
|---|---|---|
Brand Molex | ||
Series Micro-Fit 3.0 | ||
Product Type PCB Header | ||
Current 5A | ||
Pitch 3mm | ||
Number of Contacts 10 | ||
Housing Material Thermoplastic | ||
Number of Rows 2 | ||
Orientation Right Angle | ||
Shrouded/Unshrouded Shrouded | ||
Connector System Wire-to-Board | ||
Mount Type Surface | ||
Contact Plating Gold | ||
Contact Material Brass | ||
Minimum Operating Temperature -40°C | ||
Termination Type Solder | ||
Row Pitch 3mm | ||
Contact Gender Male | ||
Maximum Operating Temperature 125°C | ||
Mating Pin Length 3mm | ||
Standards/Approvals No | ||
Voltage 250 V | ||
Molex 43045 Series PCB Header, 3mm Pitch, 10 Contacts - 43045-1010
This PCB Header is a high-performance component designed for surface mount applications. It features a 3mm pitch connector with a shrouded design in a dual-row configuration, offering 10 circuits for versatile connectivity. The right-angle orientation enhances space efficiency on printed circuit boards, making it suitable for a variety of electronic setups.
Features & Benefits
• Shrouded design protects delicate pins from damage
• Excellent gold plating for reliable conductivity
• High current rating of 8.5A supports robust power applications
• Designed for surface mount termination ensuring secure placement
• Glow wire compatible, meeting safety standards for heat resistance
• Brass contacts provide durability and corrosion resistance
Applications
• Used with power management systems for effective electrical distribution
• Integrated into automation devices for reliable signal connections
• Ideal for use in appliances requiring high voltage connectivity
• Utilised in electronic control units within automotive
• Commonly found in electrical equipment for secure wire-to-board connections
What is the maximum voltage that can be handled?
The maximum voltage rating is 600V, making it suitable for high voltage applications while ensuring safety and reliability.
How does the shrouded design enhance usability?
The shrouded design prevents misalignment during insertion, providing a secure fit and reducing the risk of damage to contact pins.
What materials are used in the construction of the connector?
The connector features brass contacts with gold plating to enhance conductivity and ensure long-lasting performance in various environments.
How many mating cycles can be expected from this connector?
The connector is rated for up to 30 mating cycles, ensuring longevity in applications where regular connections and disconnections occur.
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