Amphenol Communications Solutions Bergstik Series Through Hole Pin Header, 3 Contact(s), 2.54 mm Pitch, 1 Row,
- RS-artikelnummer:
- 236-4664
- Tillv. art.nr:
- 77311-124-03LF
- Tillverkare / varumärke:
- Amphenol Communications Solutions
Mängdrabatt möjlig
Antal (1 förpackning med 20 enheter)*
64,60 kr
(exkl. moms)
80,80 kr
(inkl. moms)
GRATIS leverans för online beställningar över 500,00 kr
Tillfälligt slut
- Leverans från den 27 februari 2026
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Enheter | Per enhet | Per förpackning* |
|---|---|---|
| 20 - 80 | 3,23 kr | 64,60 kr |
| 100 - 180 | 2,929 kr | 58,58 kr |
| 200 - 380 | 2,582 kr | 51,64 kr |
| 400 + | 2,436 kr | 48,72 kr |
*vägledande pris
- RS-artikelnummer:
- 236-4664
- Tillv. art.nr:
- 77311-124-03LF
- Tillverkare / varumärke:
- Amphenol Communications Solutions
Specifikationer
Datablad
Lagstiftning och ursprungsland
Produktdetaljer
Hitta liknande produkter genom att välja ett eller flera attribut.
Välj alla | Attribut | Värde |
|---|---|---|
| Brand | Amphenol Communications Solutions | |
| Product Type | Pin Header | |
| Series | Bergstik | |
| Current | 3A | |
| Pitch | 2.54mm | |
| Number of Contacts | 3 | |
| Number of Rows | 1 | |
| Shrouded/Unshrouded | Unshrouded | |
| Mount Type | Through Hole | |
| Contact Material | Phosphor Bronze | |
| Row Pitch | 2.54mm | |
| Termination Type | Solder | |
| Standards/Approvals | No | |
| Välj alla | ||
|---|---|---|
Brand Amphenol Communications Solutions | ||
Product Type Pin Header | ||
Series Bergstik | ||
Current 3A | ||
Pitch 2.54mm | ||
Number of Contacts 3 | ||
Number of Rows 1 | ||
Shrouded/Unshrouded Unshrouded | ||
Mount Type Through Hole | ||
Contact Material Phosphor Bronze | ||
Row Pitch 2.54mm | ||
Termination Type Solder | ||
Standards/Approvals No | ||
- COO (Country of Origin):
- FR
The Amphenol ICC BergStik unshrouded header has 2.54 mm pitch provide board-to-board, wire-to-board and cable-to-board interconnect solutions for all types of electronic equipment and devices.
High temperature thermoplastic material
Reflow compatible
Variable spacing height for stacking headers
Cater to a wide range of applications
Allow dual entry, mating from top or bottom
Suitable for mezzanine application and gives more flexibility in meeting different stack height requirements
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