Molex 87759 Series Vertical Surface Mount Header, 10 Contact(s), 2 mm Pitch, 2 Row, Unshrouded

Antal (1 rör med 159 enheter)*

3 991,83 kr

(exkl. moms)

4 989,79 kr

(inkl. moms)

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RS-artikelnummer:
692-002
Tillv. art.nr:
87759-1014
Tillverkare / varumärke:
Molex
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Brand

Molex

Product Type

Header

Series

87759

Pitch

2mm

Current

2A

Number of Contacts

10

Housing Material

Nylon

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Connector System

Board to Board Connectivity

Mount Type

Surface Mount

Contact Plating

Gold

Contact Material

Phosphor Bronze

Minimum Operating Temperature

-55°C

Termination Type

Surface Mount

Maximum Operating Temperature

105°C

Standards/Approvals

UL E29179

Voltage

125V

COO (Country of Origin):
ID
The Molex Milli Grid Header is designed for seamless board-to-board and signal connections, ensuring reliable performance in electronic applications. With a vertical orientation and a robust 10-circuit design, this surface mount component features selective gold plating, offering enhanced durability and conductivity. Engineered for lead-free operation, it aligns perfectly with modern environmental standards, making it suitable for various industries. The unit's Compact size, with a mated height of just 3.80mm, ensures compatibility in space-constrained designs, while its Durable nylon and phosphor bronze materials promise longevity. Additionally, it withstands operating temperatures ranging from -55°C to +105°C, making it Ideal for a wide array of applications.

Features a Compact design suitable for space-constrained electronic assemblies
Utilises a surface mount technology for easy installation on PCBs
Offers a 10-circuit configuration for efficient signal transfer
Constructed with lead-free materials, aligning with environmental compliance
Capable of enduring a wide temperature range from -55°C to +105°C
Maintains a durability of up to 100 mating cycles, ensuring consistent performance
Made from high-quality nylon and phosphor bronze for enhanced resilience

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