Molex 41771 Series Vertical Through Hole PCB Header, 6 Contact(s), 3.96 mm Pitch, 1 Row, Unshrouded

Antal (1 förpackning med 1000 enheter)*

2 731,68 kr

(exkl. moms)

3 414,60 kr

(inkl. moms)

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1 +2 731,68 kr2,732 kr

*vägledande pris

RS-artikelnummer:
685-064
Tillv. art.nr:
26-60-2031
Tillverkare / varumärke:
Molex
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Brand

Molex

Product Type

PCB Header

Series

41771

Pitch

3.96mm

Current

7A

Number of Contacts

6

Housing Material

Polyester

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Mount Type

Through Hole

Contact Material

Brass

Contact Plating

Tin

Termination Type

Solder

Row Pitch

3.96mm

Tail Pin Length

3.56mm

Standards/Approvals

RoHS

Voltage

250 V

COO (ursprungsland):
IN
The Molex flat vertical header assembly is specifically designed for seamless connectivity in electronic applications. Featuring a robust construction with glass-filled polyester, this component ensures reliability and durability in demanding environments. It accommodates standard solderability practices, achieving excellent performance while maintaining compliance with cosmetic specifications. Its stackable design promotes efficient space management on circuit boards, making it an optimal choice for modern electronics. This header is engineered to withstand various mechanical stresses and is compatible with multiple wiring configurations, offering versatility for designers and engineers. Whether for prototype development or mass assembly, this header assembly delivers exceptional functionality.

Constructed from glass-filled polyester ensuring durability

Meets overall refloated matte tin specifications for enhanced performance

Supports a pin push-out force of 3 lbs minimum prior to soldering

Stackable design allows for efficient end to end component placement

Compatible with various PC board hole layouts for easy integration

Features void-free circuits for reliable electrical connections

Conforms to class B requirements of cosmetic specifications

Recommended for high-quality electronic assemblies in diverse markets

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