Molex 46207 Series Vertical Through Hole PCB Header, 8 Contact(s), 4.2 mm Pitch, 2 Row, Shrouded

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Antal (1 förpackning med 2 enheter)*

82,14 kr

(exkl. moms)

102,68 kr

(inkl. moms)

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  • Leverans från den 12 juni 2026
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Förpackning(ar)
Per förpackning
Per enhet*
1 - 982,14 kr41,07 kr
10 - 2475,59 kr37,795 kr
25 +68,25 kr34,125 kr

*vägledande pris

RS-artikelnummer:
665-723
Tillv. art.nr:
462071008
Tillverkare / varumärke:
Molex
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Brand

Molex

Product Type

PCB Header

Series

46207

Current

13A

Pitch

4.2mm

Housing Material

Thermoplastic

Number of Contacts

8

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Through Hole

Connector System

Wire-to-Board

Contact Material

Brass

Contact Plating

Tin

Minimum Operating Temperature

-40°C

Row Pitch

4.2mm

Termination Type

Through Hole

Contact Gender

Male

Tail Pin Length

3.66mm

Maximum Operating Temperature

105°C

COO (Country of Origin):
MX
The Molex Mini Fit Jr. Reflow Solder Capable Header is engineered for versatile connectivity in demanding electronic applications. This dual-row vertical header offers an optimal 4.20mm pitch and accommodates up to 8 circuits while ensuring reliable performance at a maximum voltage of 600V AC/DC. Crafted from durable, high-temperature thermoplastic with a matte tin plating, this header is designed to operate within a temperature range of -40° to +105°C. Ideal for board-to-board and wire-to-board applications, its innovative glow-wire capability enhances safety and efficiency during operation. The tray packaging facilitates convenient handling, making it an essential component in several electronic designs.

Glow-wire capability increases the safety quotient in sensitive applications
Matte tin plating enhances solderability and conductivity
Designed to facilitate easy mating with compatible parts, ensuring reliable connections
PCB retention features help secure the header in place, preventing disconnections
Operates effectively across a broad temperature range, suitable for various environments

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