Samtec MEC8 Series Vertical Surface PCB Header, 60 Contact(s), 0.8 mm Pitch, 2 Row, Shrouded
- RS-artikelnummer:
- 637-684
- Tillv. art.nr:
- MEC8-130-02-L-DV-A-K
- Tillverkare / varumärke:
- Samtec
Antal (1 fack med 52 enheter)*
2 379,76 kr
(exkl. moms)
2 974,70 kr
(inkl. moms)
GRATIS leverans för online beställningar över 500,00 kr
Tillfälligt slut
- Leverans från den 09 februari 2026
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Bricka(or) | Per Bricka | Per enhet* |
|---|---|---|
| 1 + | 2 379,76 kr | 45,765 kr |
*vägledande pris
- RS-artikelnummer:
- 637-684
- Tillv. art.nr:
- MEC8-130-02-L-DV-A-K
- Tillverkare / varumärke:
- Samtec
Specifikationer
Datablad
Lagstiftning och ursprungsland
Produktdetaljer
Hitta liknande produkter genom att välja ett eller flera attribut.
Välj alla | Attribut | Värde |
|---|---|---|
| Brand | Samtec | |
| Product Type | PCB Header | |
| Series | MEC8 | |
| Pitch | 0.8mm | |
| Current | 2.3A | |
| Number of Contacts | 60 | |
| Housing Material | Black LCP, Liquid Crystal Polymer | |
| Number of Rows | 2 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Surface | |
| Contact Material | Beryllium Copper Alloy | |
| Contact Plating | Gold, Tin | |
| Termination Type | Vertical Surface Mount | |
| Row Pitch | 0.8mm | |
| Minimum Operating Temperature | -55°C | |
| Maximum Operating Temperature | 125°C | |
| Standards/Approvals | PCI Express 4.0 | |
| Voltage | 255 V | |
| Välj alla | ||
|---|---|---|
Brand Samtec | ||
Product Type PCB Header | ||
Series MEC8 | ||
Pitch 0.8mm | ||
Current 2.3A | ||
Number of Contacts 60 | ||
Housing Material Black LCP, Liquid Crystal Polymer | ||
Number of Rows 2 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Surface | ||
Contact Material Beryllium Copper Alloy | ||
Contact Plating Gold, Tin | ||
Termination Type Vertical Surface Mount | ||
Row Pitch 0.8mm | ||
Minimum Operating Temperature -55°C | ||
Maximum Operating Temperature 125°C | ||
Standards/Approvals PCI Express 4.0 | ||
Voltage 255 V | ||
The Samtec Pitch mini edge card connector designed for high-density board-to-board applications. It features a vertical, dual-row configuration and is optimized for .062" (1.57 mm) thick cards, offering reliable signal integrity in compact layouts.
Optional alignment pin
Current rating up to 2.3A per contact
Includes board guide and pick and place features
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