Phoenix Contact MCDN Series Solder PCB Header, 18 Contact(s), 3.5 mm Pitch, 2 Row, Shrouded
- RS-artikelnummer:
- 557-507
- Tillv. art.nr:
- 1953787
- Tillverkare / varumärke:
- Phoenix Contact
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- RS-artikelnummer:
- 557-507
- Tillv. art.nr:
- 1953787
- Tillverkare / varumärke:
- Phoenix Contact
Specifikationer
Datablad
Lagstiftning och ursprungsland
Produktdetaljer
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Välj alla | Attribut | Värde |
|---|---|---|
| Brand | Phoenix Contact | |
| Product Type | PCB Header | |
| Series | MCDN | |
| Current | 8A | |
| Pitch | 3.5mm | |
| Housing Material | Liquid Crystal Polymer | |
| Number of Contacts | 18 | |
| Number of Rows | 2 | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Solder | |
| Connector System | COMBICON FMC 1.5 MCDN 1.5 | |
| Contact Plating | Tin Plated | |
| Contact Material | Copper Alloy | |
| Minimum Operating Temperature | -40°C | |
| Row Pitch | 3.5mm | |
| Termination Type | Solder | |
| Maximum Operating Temperature | 100°C | |
| Tail Pin Length | 2.6mm | |
| Contact Gender | Male | |
| Standards/Approvals | cULus Recognised Approval ID: E60425-20110128, VDE Approval ID: 40011723 | |
| Mating Pin Length | 2.6mm | |
| Voltage | 160 V | |
| Välj alla | ||
|---|---|---|
Brand Phoenix Contact | ||
Product Type PCB Header | ||
Series MCDN | ||
Current 8A | ||
Pitch 3.5mm | ||
Housing Material Liquid Crystal Polymer | ||
Number of Contacts 18 | ||
Number of Rows 2 | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Solder | ||
Connector System COMBICON FMC 1.5 MCDN 1.5 | ||
Contact Plating Tin Plated | ||
Contact Material Copper Alloy | ||
Minimum Operating Temperature -40°C | ||
Row Pitch 3.5mm | ||
Termination Type Solder | ||
Maximum Operating Temperature 100°C | ||
Tail Pin Length 2.6mm | ||
Contact Gender Male | ||
Standards/Approvals cULus Recognised Approval ID: E60425-20110128, VDE Approval ID: 40011723 | ||
Mating Pin Length 2.6mm | ||
Voltage 160 V | ||
- COO (Country of Origin):
- DE
The Phoenix Contact PCB Header is part of the COMBICON Connectors S product line and is suitable for through-hole reflow. The mounting type supports both THR soldering and wave soldering. The pin layout is linear pinning, with contacts MADE from copper alloy. The surface is tin-plated, and the insulating material is LCP (Liquid Crystal Polymer).
Designed for integration into the SMT soldering process
Vertical connection enables multi row arrangement on the PCB
Maximum flexibility when it comes to device design which is one header for connectors with different connection technologies
Conductor connection on several levels enables higher contact density
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