Phoenix Contact MC Series Through Hole PCB Header, 3 Contact(s), 3.5 mm Pitch, 1 Row, Shrouded

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10 148,10 kr

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12 685,12 kr

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RS-artikelnummer:
557-361
Tillv. art.nr:
1011128
Tillverkare / varumärke:
Phoenix Contact
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Brand

Phoenix Contact

Product Type

PCB Header

Series

MC

Pitch

3.5mm

Current

8A

Housing Material

Liquid Crystal Polymer

Number of Contacts

3

Number of Rows

1

Shrouded/Unshrouded

Shrouded

Connector System

COMBICON MC 1.5

Mount Type

Through Hole

Contact Material

Copper Alloy

Contact Plating

Tin Plated

Termination Type

Solder Mount

Minimum Operating Temperature

-40°C

Row Pitch

3.5mm

Tail Pin Length

1.4mm

Contact Gender

Male

Maximum Operating Temperature

100°C

Standards/Approvals

cULus Recognised, VDE

Mating Pin Length

1.4mm

Voltage

160 V

COO (Country of Origin):
DE
The Phoenix Contact robust PCB header designed for seamless integration into modern electronic devices. This versatile component supports various connection technologies, making it an ideal choice for designers seeking flexibility in their device configurations. With a nominal current capacity of 8 A and a rated voltage of 160 V, it ensures reliable performance in demanding applications. The header features a THR soldering mounting type for convenient assembly, providing mechanical stability through its screw-locking mechanism. Its compact design, with a 3.5 mm pitch and linear pinning layout, facilitates efficient space utilisation on PCBs, whilst its durable construction is compliant with industry standards, thus ensuring long-lasting usability in harsh environments.

Designed for effortless integration into SMT soldering processes

Screwable flange enhances mechanical stability for reliable connections

Offers maximum flexibility for various device designs with a single header solution

Compliant with WEEE and RoHS regulations, ensuring environmental safety

Robust construction withstands rigorous operational conditions

Optimised for through-hole reflow soldering, streamlining assembly efficiency

Resistant to corrosion and thermal stress for enhanced durability

Compact dimensions support space-saving in complex circuit layouts

High-quality materials used to minimise signal interference

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