Phoenix Contact MCDN Series Straight Wave Soldering Mount PCB Header, 30 Contact(s), 3.5 mm Pitch, 2 Row, Shrouded

Antal (1 förpackning med 40 enheter)*

12 238,15 kr

(exkl. moms)

15 297,69 kr

(inkl. moms)

Add to Basket
välj eller skriv kvantitet
Tillfälligt slut
  • Leverans från den 09 februari 2026
Behöver du mer? Ange den kvantitet du behöver och klicka på "Kontrollera leveransdatum"
Förpackning(ar)
Per förpackning
Per enhet*
1 +12 238,15 kr305,954 kr

*vägledande pris

RS-artikelnummer:
556-625
Tillv. art.nr:
1953842
Tillverkare / varumärke:
Phoenix Contact
Hitta liknande produkter genom att välja ett eller flera attribut.
Välj alla

Brand

Phoenix Contact

Series

MCDN

Product Type

PCB Header

Pitch

3.5mm

Current

8A

Number of Contacts

30

Housing Material

Liquid Crystal Polymer

Number of Rows

2

Orientation

Straight

Shrouded/Unshrouded

Shrouded

Connector System

COMBICON FMC 1

Mount Type

Wave Soldering Mount

Contact Material

Copper Alloy

Row Pitch

3.5mm

Termination Type

Solder

Minimum Operating Temperature

-40°C

Contact Gender

Male

Tail Pin Length

2.6mm

Maximum Operating Temperature

100°C

Mating Pin Length

2.6mm

Standards/Approvals

cULus Recognised, VDE approval of drawings

Voltage

160 V

COO (Country of Origin):
DE
The Phoenix Contact PCB header offers an advanced solution for connecting multiple circuits seamlessly. Engineered for integration into the SMT soldering process, this versatile component is designed to meet the demanding needs of modern electronic devices. Its compact structure allows for a high contact density while maintaining a robust performance across a variety of applications. With features tailored for through-hole reflow technology, the product’s reliability is underscored by its rich specifications, making it an ideal choice for manufacturers seeking efficiency and effectiveness. The reliable connection ensures optimal functionality, while its carefully selected materials guarantee compliance with international standards, catering to both performance and environmental considerations.

Designed for flexible device integration with various connection technologies

Facilitates higher contact density through multi-level conductor connection

Optimised for both reflow and wave soldering techniques

Lightweight design contributes to easier handling and assembly

RoHS-compliant, ensuring environmental sustainability

Features linear pinning for enhanced stability during operation

Accommodates a diverse range of applications within electronic circuitry

Superior electrical properties enhance overall performance

Packaging is efficient, minimising waste and supporting eco-friendly practices

relaterade länkar