Phoenix Contact DMC Series Wave Soldering Mount PCB Header, 22 Contact(s), 3.5 mm Pitch, 2 Row, Shrouded

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RS-artikelnummer:
556-270
Tillv. art.nr:
1053823
Tillverkare / varumärke:
Phoenix Contact
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Brand

Phoenix Contact

Product Type

PCB Header

Series

DMC

Current

8A

Pitch

3.5mm

Number of Contacts

22

Housing Material

Polybutylene Terephthalate

Number of Rows

2

Shrouded/Unshrouded

Shrouded

Connector System

COMBICON

Mount Type

Wave Soldering Mount

Contact Plating

Tin Plated

Contact Material

Copper Alloy

Minimum Operating Temperature

-40°C

Termination Type

Solder

Row Pitch

3.5mm

Tail Pin Length

3.5mm

Contact Gender

Male

Maximum Operating Temperature

100°C

Standards/Approvals

cULus Recognised

Mating Pin Length

3.5mm

Voltage

160 V

COO (ursprungsland):
CN
The Phoenix Contact PCB header offers a robust and compact solution for applications requiring higher contact densities. Ideal for use in various electronic devices, its unique design allows for a reliable conductor connection across multiple levels. The carefully engineered structure, featuring a wave soldering mounting type, ensures easy installation while maintaining optimal performance even in space-constrained environments. Manufactured in compliance with strict environmental standards, this product combines innovative technology with practicality. The use of high-quality materials guarantees durability, catering to industries where reliability is paramount. With a nominal current rating of 8 A and a voltage rating of 160 V, it meets diverse operational requirements, making it an excellent choice for modern electronic applications.

Compact design suitable for space-limited applications

Wave soldering compatible for straightforward installation

High contact density ensures efficient conductor connections

Manufactured to meet environmental compliance standards

Robust housing material for enhanced durability

Well-known pin layout promotes global compatibility

Compatible with various mounting methods for versatility

Optimised for both performance and reliability in electronic assemblies

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