Molex 21452 Series Straight Through Hole PCB Header, 16 Contact(s), 1.25 mm Pitch, 1 Row, Shrouded

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161,50 kr

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RS-artikelnummer:
536-516
Tillv. art.nr:
2145271601
Tillverkare / varumärke:
Molex
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Brand

Molex

Series

21452

Product Type

PCB Header

Pitch

1.25mm

Number of Contacts

16

Housing Material

Polybutylene Terephthalate

Number of Rows

1

Orientation

Straight

Shrouded/Unshrouded

Shrouded

Mount Type

Through Hole

Connector System

Wire-to-Board, Wire-to-Wire

Contact Plating

Tin

Termination Type

Crimp

Row Pitch

1.25mm

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

105°C

Contact Gender

Female

Standards/Approvals

Compliant per EU 2015/863 chemSHERPA (xml) IPC 1752A Class D Molex Product Compliance Declaration, Eu RoHS REACH SVHC Low-Halogen, IEC-62474, IPC 1752A Class C

COO (Country of Origin):
VN
The Molex Micro Lock Plus TPA is a premium receptacle housing engineered to provide reliable connections in various applications, including wire to board and wire to wire scenarios. Designed with a 1.25mm pitch, this low halogen component guarantees enhanced performance in environments requiring strict compliance with environmental standards. Its dual row design accommodates up to 16 circuits, ensuring a compact and efficient layout without compromising on reliability. The robust construction coupled with a positive lock mechanism ensures a secure connection, making it an ideal choice for modern electronic devices. This product embodies a perfect blend of durability and functionality, making it an essential component for engineers and manufacturers alike.

Dual row configuration optimises space within tight layouts

Low halogen construction supports environmental compliance

Designed to accommodate a maximum of 16 circuits for versatility

Offers a secure positive lock to prevent accidental disconnections

Compatible with various Micro Lock Plus headers for flexible integration

Built from PBT resin providing excellent thermal stability

Polarised design ensures proper alignment during assembly

Unmatched operational temperature range enhances reliability in varying conditions

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