TE Connectivity AMPMODU Series Right Angle Board PCB Header, 50 Contact(s), 2 mm Pitch, 2 Row, Unshrouded

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2 473,28 kr

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3 091,60 kr

(inkl. moms)

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RS-artikelnummer:
526-190
Distrelec artikelnummer:
304-53-498
Tillv. art.nr:
1-5084108-2
Tillverkare / varumärke:
TE Connectivity
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Brand

TE Connectivity

Product Type

PCB Header

Series

AMPMODU

Current

1A

Pitch

2mm

Number of Contacts

50

Housing Material

Polyphenylene Sulphide

Number of Rows

2

Orientation

Right Angle

Shrouded/Unshrouded

Unshrouded

Connector System

Board-to-Board

Mount Type

Board

Contact Material

Copper Alloy

Contact Plating

Gold

Row Pitch

2mm

Termination Type

Surface Mount

Mating Pin Length

3.86mm

Standards/Approvals

UL

COO (Country of Origin):
SG
The TE Connectivity connector is designed for seamless board-to-board connections in a compact form factor. This product showcases a robust construction with a sleek black housing made from high-quality polyphenylene sulfide (PPS) to ensure durability and reliability in demanding applications. With an unshrouded header type, it features right-angle PCB mount orientation to facilitate efficient space utilisation on circuit boards. The connector supports a fully loaded configuration with 50 positions across 2 rows, all encapsulated in a design that adheres to industry standards, making it suitable for various signal circuit applications. This connector's reflow solder capability ensures ease of integration into modern manufacturing processes, positioning it as an indispensable component for engineers and designers seeking high-performance solutions.

Designed for board-to-board connectivity with a right-angle orientation

Constructed from durable polyphenylene sulfide for enhanced longevity

Supports a maximum contact current rating of 1 A for reliable performance

Features nickel underplating for enhanced contact reliability

Aligns easily with locating posts for simple PCB installation

Operates in compliance with international standards, assuring quality and safety

Capable of withstanding high-temperature soldering processes without degradation

Suitable for applications requiring compact and efficient interconnect solutions

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