Phoenix Contact DMCV Series Straight Wave Soldering Mount PCB Header, 40 Contact(s), 3.5 mm Pitch, 2 Row, Shrouded

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RS-artikelnummer:
521-402
Tillv. art.nr:
1875026
Tillverkare / varumärke:
Phoenix Contact
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Brand

Phoenix Contact

Series

DMCV

Product Type

PCB Header

Pitch

3.5mm

Current

8A

Housing Material

Liquid Crystal Polymer

Number of Contacts

40

Number of Rows

2

Orientation

Straight

Shrouded/Unshrouded

Shrouded

Mount Type

Wave Soldering Mount

Connector System

COMBICON DFMC 1

Contact Plating

Tin Plated

Contact Material

Copper Alloy

Termination Type

Solder

Minimum Operating Temperature

-40°C

Row Pitch

3.5mm

Contact Gender

Male

Tail Pin Length

2.6mm

Maximum Operating Temperature

100°C

Mating Pin Length

2.6mm

Standards/Approvals

No

Voltage

160 V

COO (Country of Origin):
DE
The Phoenix Contact PCB header, designed for seamless integration into the SMT soldering process, excels in versatility and compactness. Featuring a 3.5 mm pitch, it supports multi-row arrangements, making it ideal for scenarios where space is a premium. The vertical connection and snap-in locking mechanism enhance mechanical stability while simplifying installation and release. Crafted with precision, this product redefines reliability in electrical connectivity, ensuring optimal performance across various applications. With a robust construction that adheres to the highest industry standards, it promises durability in demanding conditions, making it the go-to choice for professionals seeking reliable and efficient connectivity solutions.

Optimised for THR soldering and wave soldering technologies

Compact design accommodates tight spaces without compromising functionality

Screwable flange provides enhanced mechanical stability during operation

Lock and Release operating lever enables effortless connection and disconnection

WEEE/RoHS compliant, ensuring environmental responsibility

Visual inspection passes rigorous IEC standards for quality assurance

Durable materials guarantee longevity and reliability in harsh environments

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