TE Connectivity AMPMODU Series Vertical Board PCB Header, 8 Contact(s), 2.54 mm Pitch, 1 Row, Shrouded

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2 531,76 kr

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3 164,70 kr

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RS-artikelnummer:
520-615
Tillv. art.nr:
5-103908-7
Tillverkare / varumärke:
TE Connectivity
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Brand

TE Connectivity

Series

AMPMODU

Product Type

PCB Header

Current

3A

Pitch

2.54mm

Number of Contacts

8

Housing Material

Thermoplastic

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Board

Connector System

Wire-to-Board

Contact Material

Brass

Contact Plating

Gold

Termination Type

Solder

Minimum Operating Temperature

65°C

Row Pitch

2.54mm

Tail Pin Length

3.3mm

Maximum Operating Temperature

105°C

Standards/Approvals

CSA LR7189, UL 94V-0, UL E28476

Voltage

60 V

Distrelec Product Id

304-50-830

COO (Country of Origin):
MX
The TE Connectivity PCB mount header represents a pinnacle of connectivity solutions tailored for wire-to-board applications. Designed with an 8-position configuration, this vertical connector ensures optimal space efficiency while maintaining robust electrical performance. Its fully shrouded design, coupled with gold-plated contacts, enhances signal integrity and provides durability for demanding environments. This connector assembly is engineered for through-hole soldering, ensuring a secure and permanent attachment to printed circuit boards. With a recommended operating temperature range of -65 to 105 °C, this product excels in both consumer electronics and industrial applications, making it a versatile addition to any engineering toolkit. Experience reliability and performance with this exceptional connection solution, supporting seamless integration into your electronic designs.

Optimised for vertical mounting, saving precious PCB space

Robust construction for a secure fit during demanding operational conditions

Enhanced signal integrity with gold (Au) contact plating

Designed to withstand a wide operating temperature range, ideal for various applications

Provides a reliable connection with a termination resistance of just 15 mΩ

Features an innovative retention design that ensures stable mating alignment

Presented in compliant packaging, emphasising sustainability in manufacturing

Perfectly suited for high-density layouts without compromising performance

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