Molex 87831 Series Vertical Through Hole PCB Header, 4 Contact(s), 2 mm Pitch, 2 Row, Shrouded

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2 457,98 kr

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3 072,48 kr

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RS-artikelnummer:
507-404
Distrelec artikelnummer:
304-62-757
Tillv. art.nr:
87831-0443
Tillverkare / varumärke:
Molex
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Brand

Molex

Series

87831

Product Type

PCB Header

Current

2A

Pitch

2mm

Housing Material

Nylon

Number of Contacts

4

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Through Hole

Contact Material

Phosphor Bronze

Contact Plating

Gold

Row Pitch

2mm

Termination Type

Solder

Minimum Operating Temperature

-55°C

Tail Pin Length

2.50mm

Maximum Operating Temperature

105°C

Standards/Approvals

94V-0, CSA LR19980, UL E29179

Voltage

125 V

COO (ursprungsland):
MY
The TE Connectivity Milli-Grid PCB Header is engineered for versatility and reliability, designed to accommodate a variety of applications. Featuring a compact 2.00mm pitch, this dual-row configuration allows for efficient multi-circuit connections in signal and wire-to-board setups. With its shrouded design and locking window, the component offers enhanced stability and ease of handling, ensuring secure mating with compatible receptacles. The durable nylon construction and high-quality gold plating for mating areas provide enduring performance under challenging conditions. Optimized for environments with operational temperatures ranging from -55° to +105°C, this product is an ideal choice for various projects requiring robust connection solutions. Its impressive 100 mating cycles highlight its durability, making it suitable for both industrial and consumer electronics.

Compact design streamlines PCB layouts for space-constrained applications

Shrouded structure enhances safety and reliability during connections

Compatibility with multiple receptacles broadens usage in various designs

Locking window feature prevents unintentional disconnections in dynamic environments

Exceptional durability with a mating cycle lifespan of 100 cycles ensures long-term performance

Resistant to temperature extremes, optimizing performance in diverse applications

Low profile facilitates better airflow and reduces space needs on the PCB

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