TE Connectivity AMPMODU Series Vertical Board PCB Header, 40 Contact(s), 2.54 mm Pitch, 2 Row, Unshrouded

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2 637,71 kr

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3 297,14 kr

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RS-artikelnummer:
506-992
Tillv. art.nr:
2-87227-0
Tillverkare / varumärke:
TE Connectivity
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Brand

TE Connectivity

Series

AMPMODU

Product Type

PCB Header

Pitch

2.54mm

Current

3A

Number of Contacts

40

Housing Material

Thermoplastic

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Connector System

Board-to-Board

Mount Type

Board

Contact Material

Phosphor Bronze

Contact Plating

Gold

Termination Type

Solder

Minimum Operating Temperature

-55°C

Row Pitch

2.54mm

Maximum Operating Temperature

125°C

Tail Pin Length

3.18mm

Standards/Approvals

RoHS

Voltage

750 Vrms

Distrelec Product Id

304-53-862

COO (ursprungsland):
MX
The TE Connectivity PCB Mount Header is an innovative solution designed for vertical, board-to-board connectivity. This component seamlessly integrates with a variety of circuit applications, ensuring reliable performance and efficiency. Its unshrouded header type allows for easy mating with other connectors, offering versatility in different circuit designs, while maintaining a compact footprint. With a 40-position layout and a 2.54 mm centerline, it caters to high-density configurations, making it ideal for space-constrained applications. The robust construction features gold plating for optimum conductivity and durability, ensuring long-lasting connection integrity. Enhanced insulation resistance and dielectric withstand capabilities position this header as a standout choice for contemporary electronic assemblies, while the thermoplastic housing withstands various operational demands.

Designed for board-to-board configurations, simplifying connections between PCBs

Optimized for high-density designs, perfect for compact electronic devices

Unshrouded design facilitates easier mating with compatible connectors

Gold plating enhances conductivity, ensuring reliable performance

Robust thermoplastic housing guarantees durability under various conditions

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