TE Connectivity AMPMODU MTE Series Right Angle Board PCB Header, 10 Contact(s), 2.54 mm Pitch, 1 Row, Shrouded

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3 190,37 kr

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3 987,96 kr

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RS-artikelnummer:
504-396
Distrelec artikelnummer:
304-48-492
Tillv. art.nr:
103906-9
Tillverkare / varumärke:
TE Connectivity
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Brand

TE Connectivity

Series

AMPMODU MTE

Product Type

PCB Header

Pitch

2.54mm

Current

3A

Number of Contacts

10

Housing Material

Thermoplastic

Number of Rows

1

Orientation

Right Angle

Shrouded/Unshrouded

Shrouded

Connector System

Wire-to-Board

Mount Type

Board

Contact Plating

Gold

Contact Material

Copper Alloy

Termination Type

Solder

Minimum Operating Temperature

65°C

Row Pitch

2.54mm

Tail Pin Length

3.3mm

Maximum Operating Temperature

105°C

Contact Gender

Male

Standards/Approvals

CSA LR7189, UL E28476

Mating Pin Length

5.84mm

Voltage

60 V

Uppfyller ej RoHS

COO (Country of Origin):
US
The TE Connectivity PCB mount header is designed for right-angle wire-to-board connections, providing a robust solution for your electronic assembly needs. Offering a 10-position configuration with a centreline of 2.54 mm, this fully shrouded connector is built to withstand demanding applications. Featuring a combination of durable materials and precise engineering, it ensures reliable performance and excellent electrical characteristics, making it ideal for signal circuit applications. With its through-hole solder termination method, compatibility with various PCB thicknesses, and a temperature range suitable for diverse environments, this connector ensures ease of integration and longevity in your projects. Its thoughtful design includes provisions for fastening, aligning, and retaining the connector securely, which is essential for maintaining system integrity even in challenging conditions.

Designed for right angle PCB mounting to optimise space on your circuit board

Fully shrouded header type supports greater reliability in connections

Constructed with a thermoplastic housing ensuring durability and resistance to environmental factors

Optimised for through hole solder termination for improved mechanical stability

Features low termination resistance for enhanced electric flow and reduced heating

Compact size contributes to space efficiency in electronic designs

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