TE Connectivity 172732 Series Vertical Board PCB Header, 4 Contact(s), 2.5 mm Pitch, 1 Row, Shrouded

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RS-artikelnummer:
501-326
Tillv. art.nr:
172732-4
Tillverkare / varumärke:
TE Connectivity
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Brand

TE Connectivity

Series

172732

Product Type

PCB Header

Current

3.5A

Pitch

2.5mm

Housing Material

Polyamide 66

Number of Contacts

4

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Connector System

Wire-to-Board

Mount Type

Board

Contact Plating

Tin Lead

Contact Material

Brass

Row Pitch

2.5mm

Termination Type

Solder

Minimum Operating Temperature

-20°C

Maximum Operating Temperature

95°C

Tail Pin Length

3.6mm

Standards/Approvals

2016, China RoHS 2 Directive MIIT Order No 32, EU ELV Directive 2000/53/EC Compliant, EU RoHS Directive 2011/65/EU Compliant, UL 94V-0

Mating Pin Length

7.5mm

Voltage

250 V

COO (Country of Origin):
JP
The TE Connectivity PCB mount header is designed for vertical wire-to-board connections, making it an essential component for compact electronic assemblies. Constructed with high-quality materials, it provides reliable connectivity in a variety of applications, particularly in environments requiring robust performance. The partially shrouded design enhances mating security, while the natural nylon housing ensures durability through a range of operational stresses. This connector is engineered for ease of installation, featuring through-hole soldering for secure placement on printed circuit boards. Its four-position configuration allows for efficient space utilisation in your layouts, catering to diverse connectivity needs without compromising on performance.

Durable construction withstands operational stress over time

Designed for secure and dependable wire-to-board connections

Partially shrouded design enhances safety and reliability

Compact form factor maximises board space efficiency

Facilitates straightforward soldering to PCB for quick installation

Compatible with various electronic applications requiring dependable signals

Low-profile design contributes to overall space optimisation within devices

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