TE Connectivity AMPMODU System 50 Series Vertical Board PCB Header, 12 Contact(s), 1.27 mm Pitch, 1 Row, Shrouded

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2 575,98 kr

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3 219,98 kr

(inkl. moms)

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RS-artikelnummer:
498-288
Tillv. art.nr:
1-104071-1
Tillverkare / varumärke:
TE Connectivity
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Brand

TE Connectivity

Product Type

PCB Header

Series

AMPMODU System 50

Pitch

1.27mm

Current

3.6A

Number of Contacts

12

Housing Material

Liquid Crystal Polymer

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Board

Connector System

Board-to-Board

Contact Material

Copper Alloy

Contact Plating

Gold

Row Pitch

1.27mm

Termination Type

Solder

Minimum Operating Temperature

65°C

Maximum Operating Temperature

105°C

Tail Pin Length

2.54mm

Contact Gender

Male

Standards/Approvals

RoHS

Voltage

30 V

Distrelec Product Id

304-53-359

Uppfyller ej RoHS

COO (Country of Origin):
US
The TE Connectivity PCB Mount Header is an innovative solution designed for seamless connectivity in board-to-board applications. With a fully shrouded design, it ensures secure connections while maintaining an efficient use of space. This versatile connector accommodates 12 positions on a 1.27 mm centreline, making it ideal for compact applications. Engineered with robust materials, it offers exceptional durability and reliability across various operating conditions. The black housing not only adds a sleek aesthetic but also contributes to the product's performance capabilities. Operating effectively within a temperature range from -65 to 105 °C, it meets the demanding requirements of modern electronic devices. This connector is more than just a component; it embodies strength, reliability, and versatility for your connectivity needs.

Designed for board to board configurations ensuring reliable connections

Features a fully shrouded header for enhanced safety and stability

Constructed from durable housing material to withstand rigorous use

Offers straightforward through hole soldering for ease of installation

Incorporates a latching type for secure mating retention during assembly

Facilitates efficient signal transmission essential for high performance applications

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