Phoenix Contact MCV Series Straight Wave Soldering Mount PCB Header, 7 Contact(s), 5.08 mm Pitch, 1 Row, Shrouded

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2 070,54 kr

(exkl. moms)

2 588,18 kr

(inkl. moms)

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RS-artikelnummer:
483-841
Tillv. art.nr:
1836341
Tillverkare / varumärke:
Phoenix Contact
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Brand

Phoenix Contact

Product Type

PCB Header

Series

MCV

Pitch

5.08mm

Current

8A

Number of Contacts

7

Housing Material

Polybutylene Terephthalate

Number of Rows

1

Orientation

Straight

Shrouded/Unshrouded

Shrouded

Connector System

COMBICON MC 1.5

Mount Type

Wave Soldering Mount

Contact Material

Copper Alloy

Row Pitch

5.08mm

Termination Type

Solder

Minimum Operating Temperature

-40°C

Contact Gender

Male

Tail Pin Length

3.4mm

Maximum Operating Temperature

100°C

Mating Pin Length

3.4mm

Standards/Approvals

CSA 13631, cULus E60425-20110128, IEC 60068-2-70, IEC 60068-2-82, IEC 60112, IEC 60512-1-1, IEC 60512-1-2, IEC 60512-13-5, IEC 60512-15-1, IEC 60512-3-1, IEC 60512-5-1, IEC 60664-1, ISO 6988, JEDEC JESD 201, UL 94 V0, VDE 40011723

Voltage

32 V

COO (Country of Origin):
DE
The Phoenix Contact PCB header is designed for efficiency and flexibility within various device designs. With a versatile pin layout and designed for wave soldering, it facilitates easy integration into printed circuit boards. The product strikes a balance between reliability and performance, ideal for connecting multiple rows of components. Its robust construction ensures enduring functionality, while the green housing provides visual identification in complex setups. This connector is part of the MCV 1.5/-G series, delivering exceptional compatibility with different connection technologies, making it a staple for both new designs and upgrades alike.

Optimised for multi-row arrangements on printed circuit boards

Built to support various connection technologies with a single header

Constructed with a green housing for easy identification

Compliance with WEEE/RoHS regulations ensures environmental safety

Efficiently designed for wave soldering to enhance assembly processes

Delivers high nominal current capacity for demanding applications

Includes linear pinning for enhanced connection stability

Fitted with tin-plated surfaces for improved conductivity

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