TE Connectivity Z-PACK Series Vertical Board PCB Header, 175 Contact(s), 2 mm Pitch, 7 Row, Unshrouded

Se alla PCB Headers

Antal (1 rör med 10 enheter)*

2 313,02 kr

(exkl. moms)

2 891,28 kr

(inkl. moms)

Add to Basket
välj eller skriv kvantitet
Tillfälligt slut
  • Leverans från den 20 januari 2026
Behöver du mer? Ange den kvantitet du behöver och klicka på "Kontrollera leveransdatum"
Rör
Per Rør
Per enhet*
1 +2 313,02 kr231,302 kr

*vägledande pris

RS-artikelnummer:
480-994
Tillv. art.nr:
5106510-1
Tillverkare / varumärke:
TE Connectivity
Hitta liknande produkter genom att välja ett eller flera attribut.
Välj alla

Brand

TE Connectivity

Product Type

PCB Header

Series

Z-PACK

Current

1.5A

Pitch

2mm

Housing Material

Fibreglass Polyester

Number of Contacts

175

Number of Rows

7

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Connector System

Board-to-Board

Mount Type

Board

Contact Material

Phosphor Bronze

Contact Plating

Gold

Minimum Operating Temperature

-55°C

Termination Type

Solder

Row Pitch

2mm

Maximum Operating Temperature

125°C

Contact Gender

Male

Standards/Approvals

2016, China RoHS 2 Directive MIIT Order No 32, EU ELV Directive 2000/53/EC Compliant, EU RoHS Directive 2011/65/EU Compliant, UL 94V-0

Mating Pin Length

5.25mm

Distrelec Product Id

304-50-002

COO (Country of Origin):
CN
The TE Connectivity Hard Metric Backplane PCB Mount Header is engineered for high-performance applications with data rates of up to 1 Gb/s. Designed with 25 columns and 7 rows, this mezzanine connector accommodates a total of 175 positions, ensuring reliable connectivity in a compact form factor. Its vertical mounting orientation streamlines installation on printed circuit boards, while the robust construction, featuring a grey polyester housing, provides durability and resilience against environmental stresses. With nickel underplating and gold plating on the contacts, it guarantees optimal electrical performance and corrosion resistance. This connector is an ideal choice for traditional backplane systems where securing ground return shielding and signal integrity are paramount, making it a preferred solution in telecommunications and industrial settings.

Offers a compact design with 175 signal positions for efficient space utilisation

Connects easily to printed circuit boards, enhancing installation flexibility

Constructed with high-quality materials for improved durability and longevity

Features consistent data transmission rates, ensuring system reliability

Compatible with traditional backplane architectures for versatile application

Provides effective shielding to reduce crosstalk and maintain signal quality

Optimised for a wide operating temperature range, accommodating diverse environmental conditions

Available in packaging quantities that suit your project requirements

relaterade länkar