Molex 503772 Series Vertical Surface PCB Header, 20 Contact(s), 0.4 mm Pitch, 2 Row, Shrouded

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20 123,96 kr

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25 154,95 kr

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RS-artikelnummer:
480-943
Tillv. art.nr:
503772-2010
Tillverkare / varumärke:
Molex
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Brand

Molex

Product Type

PCB Header

Series

503772

Pitch

0.4mm

Current

0.3A

Number of Contacts

20

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Surface

Contact Plating

Gold

Contact Material

Copper Alloy

Termination Type

Surface Mount

Row Pitch

0.4mm

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

85°C

Standards/Approvals

REACH, RoHS

Voltage

50 V

Distrelec Product Id

304-56-503

COO (ursprungsland):
JP
The TE Connectivity Stacking Board Connector redefines connectivity with its 0.40mm pitch board-to-board design, delivering both space efficiency and reliability. Designed for modern electronic applications, it features a dual row and vertical configuration that facilitates optimal stacking height. Crafted specifically for surface mount technology, this connector supports 20 circuits, making it an ideal choice for compact assemblies. Its exceptional durability, rated for up to 30 mating cycles, ensures long-lasting performance while its low-halogen materials contribute to environmental compliance. As device footprints shrink, this connector demonstrates a commitment to precision engineering and user-focused design, embodying an ideal balance of functionality and aesthetic integration in a versatile solution for a variety of applications.

Offers a slim profile to maximise space in compact designs

Utilises environmentally compliant materials that align with industry standards

Features a robust construction to withstand high-reliability applications

Designed for easy integration with PCB layouts, ensuring effortless assembly

Employs a surface mount style for straightforward mounting on circuit boards

Supports a wide temperature range, accommodating diverse operating environments

Incorporates dual row functionality for enhanced circuit density without compromising performance

Ensures electrical integrity even under demanding operational conditions

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