TE Connectivity AMP-LATCH Series Vertical Board PCB Header, 20 Contact(s), 2.54 mm Pitch, 2 Row

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2 346,73 kr

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2 933,41 kr

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RS-artikelnummer:
479-315
Tillv. art.nr:
1-746611-0
Tillverkare / varumärke:
TE Connectivity
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Brand

TE Connectivity

Product Type

PCB Header

Series

AMP-LATCH

Pitch

2.54mm

Current

1A

Housing Material

Thermoplastic

Number of Contacts

20

Number of Rows

2

Orientation

Vertical

Connector System

Wire-to-Board

Mount Type

Board

Contact Plating

Gold

Contact Material

Phosphor Bronze

Row Pitch

2.54mm

Termination Type

IDC

Minimum Operating Temperature

65°C

Tail Pin Length

3.94mm

Contact Gender

Male

Maximum Operating Temperature

105°C

Standards/Approvals

RoHS

Voltage

250 V

Distrelec Product Id

304-48-420

COO (Country of Origin):
CN
The TE Connectivity wire-to-board connector is engineered for enhanced performance and stability in electronic applications. Designed with a 20-position configuration, it facilitates seamless connections while ensuring optimal signal integrity. The component features a 2.54 mm pitch and a versatile vertical orientation, making it ideal for a variety of printed circuit board designs. With robust through-hole soldering capabilities, it guarantees secure mounting and reliable conductivity. This connector stands out for its standard profile and ribbon cable compatibility, making it a perfect choice for demanding environments. Rated to withstand an operating temperature range of -65 to 105 °C, it ensures stable performance under various conditions, thus fulfilling the stringent requirements of modern electronics.

Offers a reliable and secure connection between boards and cables

Facilitates easy integration into diverse electronic systems

Ensures structural reliability with its durable thermoplastic housing

Designed for efficient heat dissipation, enhancing performance longevity

Supports a wide range of wire sizes for flexible application needs

Meets essential compliance standards, ensuring safety and reliability

Features an inline contact layout for improved space efficiency

Streamlines installation with an easy-to-use IDC termination method

Exemplifies robust engineering suitable for high-frequency signal applications

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