TE Connectivity 51779 Series Vertical Board PCB Header, 60 Contact(s), 0.8 mm Pitch, 2 Row, Shrouded

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47 201,50 kr

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59 001,88 kr

(inkl. moms)

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RS-artikelnummer:
478-801
Tillv. art.nr:
5177986-2
Tillverkare / varumärke:
TE Connectivity
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Brand

TE Connectivity

Series

51779

Product Type

PCB Header

Pitch

0.8mm

Current

0.5A

Housing Material

Matt

Number of Contacts

60

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Board

Connector System

Board-to-Board

Contact Material

Brass

Contact Plating

Gold

Minimum Operating Temperature

-40°C

Row Pitch

0.8mm

Termination Type

Surface Mount

Maximum Operating Temperature

125°C

Standards/Approvals

UL 94 V-0

Voltage

100 V

Distrelec Product Id

304-50-955

COO (Country of Origin):
CN
The TE Connectivity PCB Mount Header is designed for vertical, board-to-board applications, offering an impressively compact solution that caters to modern electronic requirements. With 60 positions and a narrow 0.8 mm pitch, it ensures both space efficiency and high connectivity for a variety of applications. Its fully shrouded design and natural steel construction afford excellent reliability and durability, making it ideal for intricate PCB layouts. This connector not only meets rigorous industry standards but also incorporates advanced materials that demonstrate exceptional performance. With the capability to withstand operating temperatures ranging from -40°C to 125°C, this connector is suitable for diverse environments. Its low halogen content and compliance with EU directives underscore commitment to sustainability, making it a responsible choice for your next project.

Compatible with surface mount technology for quicker assembly processes

Insulation resistance ensures long-lasting performance and reliability

Optimised for high-density applications without compromise on signal integrity

Polarised alignment features facilitate accurate and easier mating during installation

Low halogen composition adheres to environmental regulations

Engineered for reflow solder capability, supporting modern manufacturing processes

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