Molex 50235 Series Right Angle Surface Base Strip, 4 Contact(s), 2 mm Pitch, 1 Row

Antal (1 rulle med 700 enheter)*

4 544,13 kr

(exkl. moms)

5 680,16 kr

(inkl. moms)

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RS-artikelnummer:
478-758
Tillv. art.nr:
502352-0401
Tillverkare / varumärke:
Molex
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Brand

Molex

Product Type

Base Strip

Series

50235

Pitch

2mm

Current

3A

Housing Material

Polyamide

Number of Contacts

4

Number of Rows

1

Orientation

Right Angle

Mount Type

Surface

Contact Plating

Tin

Contact Material

Copper Alloy

Row Pitch

2mm

Termination Type

Surface Mount

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

105°C

Standards/Approvals

UL E29179

Voltage

125 V

Distrelec Product Id

304-56-421

COO (ursprungsland):
CN
The TE Connectivity wire-to-board header presents a reliable and efficient connection solution designed for high-performance applications, particularly in automotive and signal tasks. Featuring a single row configuration with a right-angle orientation, this product boasts four circuits with superior durability and electrical performance. The robust Tin (Sn) plating enhances its resistance to corrosion, making it suitable for varied environments. With a temperature range of -40° to +105°C, it ensures consistent operation in extreme conditions. Coupled with its lightweight design and easy installation via surface mount termination, this header simplifies assembly processes, ensuring a secure fit in diverse applications.

Constructed with high-quality polyamide resin for enhanced durability

Designed to support a maximum current of 3.0A per contact for robust electrical performance

Offers a streamlined mating height of 6.40mm for space-efficient installations

Features copper alloy for increased reliability in electrical conductivity

Incorporates a keying mechanism ensuring secure mating with compatible parts

Utilises embossed tape on reel packaging, facilitating straightforward handling and storage

Meets stringent compliance standards, ensuring adherence to industry regulations

Supports lead-free solder processes, reflecting a commitment to modern manufacturing practices

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