TE Connectivity AMPMODU Series Right Angle Board PCB Header, 14 Contact(s), 2.54 mm Pitch, 2 Row, Shrouded

Antal (1 fack med 120 enheter)*

5 960,98 kr

(exkl. moms)

7 451,22 kr

(inkl. moms)

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RS-artikelnummer:
478-105
Distrelec artikelnummer:
304-50-800
Tillv. art.nr:
5-103166-5
Tillverkare / varumärke:
TE Connectivity
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Brand

TE Connectivity

Product Type

PCB Header

Series

AMPMODU

Current

3A

Pitch

2.54mm

Housing Material

Thermoplastic

Number of Contacts

14

Number of Rows

2

Orientation

Right Angle

Shrouded/Unshrouded

Shrouded

Mount Type

Board

Connector System

Board-to-Board, Wire-to-Board

Contact Plating

Gold

Contact Material

Phosphor Bronze

Row Pitch

2.54mm

Termination Type

Solder

Minimum Operating Temperature

65°C

Maximum Operating Temperature

105°C

Tail Pin Length

3.43mm

Standards/Approvals

CSA LR7189, UL 94V-0, UL E28476

Voltage

750 Vrms

COO (Country of Origin):
MX
The TE Connectivity PCB Mount Header is a precision-engineered connector designed to facilitate seamless connections in both board-to-board and wire-to-board configurations. With its right-angle orientation and fully shrouded design, this connector not only enhances space efficiency but also ensures secure and reliable connections. Its substantial 14-position capacity, complemented by a 2.54 mm centreline spacing, makes it an ideal choice for complex electronic applications. The robust gold-plated contacts guarantee excellent conductivity, while the thermoplastic housing provides durability under varying environmental conditions, catering to diverse operational requirements. This high-performance header is designed to meet the demands of modern electronic systems, ensuring dependable signal integrity and reliable performance across various applications.

Optimised for PCB applications, ensuring versatility in various configurations

Right-angle design streamlines installation while conserving board space

Fully shrouded header type protects contacts from damage and contamination

Compatible with board standoff solder processes, enhancing assembly reliability

Standard housing temperature rating accommodates a wide operating range

Nickel contact underplating ensures durability and extended lifespan

Detent window feature enhances mating retention for a secure fit

Packaging in large quantities ensures availability for high-volume projects

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