TE Connectivity AMPMODU Series Right Angle Through Hole PCB Header, 10 Contact(s), 2 mm Pitch, 1 Row, Shrouded

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2 579,36 kr

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3 224,20 kr

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RS-artikelnummer:
477-697
Distrelec artikelnummer:
304-53-468
Tillv. art.nr:
1-2842110-0
Tillverkare / varumärke:
TE Connectivity
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Brand

TE Connectivity

Product Type

PCB Header

Series

AMPMODU

Pitch

2mm

Current

2A

Housing Material

Polyamide Fibreglass

Number of Contacts

10

Number of Rows

1

Orientation

Right Angle

Shrouded/Unshrouded

Shrouded

Connector System

Board-to-Board

Mount Type

Through Hole

Contact Material

Brass

Contact Plating

Gold

Row Pitch

2mm

Minimum Operating Temperature

-40°C

Termination Type

Solder

Maximum Operating Temperature

125°C

Tail Pin Length

2.8mm

Mating Pin Length

4mm

Standards/Approvals

UL 94 V-0

Voltage

125 V

COO (Country of Origin):
CN
The TE Connectivity PCB Mount Header is an essential component and a perfect solution for board-to-board connections. Designed with precision, the header features a right-angle orientation and boasts ten positions for efficient connectivity. Crafted to meet high-quality standards, it ensures reliable electrical performance, catering to diverse applications. The breakaway design enhances versatility during assembly, while the gold plating offers superior conductivity and resistance to tarnish. Built for high operational efficiency, this header withstands demanding temperature ranges to ensure consistent performance in various environments. Additionally, the combination of durable materials and thoughtful engineering delivers a product that meets industry standards, making it a trusted choice for electronics manufacturers.

Right-angle orientation simplifies PCB layout

Ten positions facilitate multiple connection points

Breakaway design supports flexible assembly options

Gold plating enhances conductivity and longevity

Durable materials ensure reliability under demanding conditions

Meets stringent industry standards for quality assurance

High temperature rating suitable for challenging applications

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