TE Connectivity MATE-N-LOK Series Vertical Board PCB Header, 2 Contact(s), 3 mm Pitch, 2 Row, Shrouded

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RS-artikelnummer:
477-331
Distrelec artikelnummer:
304-58-610
Tillv. art.nr:
3-794682-2
Tillverkare / varumärke:
TE Connectivity
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Brand

TE Connectivity

Series

MATE-N-LOK

Product Type

PCB Header

Current

5A

Pitch

3mm

Number of Contacts

2

Housing Material

Nylon

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Board

Connector System

Wire-to-Board

Contact Plating

Gold

Contact Material

Brass

Minimum Operating Temperature

-40°C

Termination Type

Solder

Row Pitch

3mm

Maximum Operating Temperature

105°C

Tail Pin Length

3.18mm

Standards/Approvals

CNR, UL E28476, USR, VDE, VDE 40005280

Voltage

250 V

COO (ursprungsland):
CN
The TE Connectivity Highly versatile PCB mount header, specifically designed to meet the demanding requirements of modern electronic applications. Featuring a fully shrouded structure, it ensures secure and reliable connections in wire-to-board assemblies. With a vertical orientation and a compact 3 mm centreline, this connector is ideal for tight spaces and provides exceptional performance. The advanced gold plating on the contacts guarantees improved conductivity and resistance to corrosion, allowing for extended operational longevity. Whether used in industrial or commercial applications, this connector reliably supports power distribution and signal transfer, making it a staple for engineers seeking efficiency without compromising on quality.

Designed for vertical PCB mounting to optimise space utilisation

Constructed with high-temperature nylon for enhanced durability

Features a locking tab for secure mating retention

Simple integration into existing designs with through-hole solder termination

Offers a polarised mating alignment for error-free connections

Compliance with EU RoHS and other environmental standards

Suitable for applications up to 250 VDC operating voltage

Provides excellent mechanical stability through PCB retention features

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