TE Connectivity AMP HPI Series Vertical Board PCB Header, 5 Contact(s), 2 mm Pitch, 1 Row, Shrouded

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4 284,49 kr

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5 355,61 kr

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RS-artikelnummer:
477-304
Tillv. art.nr:
440054-5
Tillverkare / varumärke:
TE Connectivity
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Brand

TE Connectivity

Series

AMP HPI

Product Type

PCB Header

Current

3A

Pitch

2mm

Number of Contacts

5

Housing Material

Polyamide 66 Fibreglass

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Board

Connector System

Wire-to-Board

Contact Plating

Tin Plated

Contact Material

Brass

Minimum Operating Temperature

-25°C

Termination Type

Solder

Row Pitch

2mm

Tail Pin Length

3.4mm

Maximum Operating Temperature

85°C

Contact Gender

Male

Mating Pin Length

3.35mm

Standards/Approvals

No

Voltage

250 V

Distrelec Product Id

304-50-777

COO (Country of Origin):
CN
The TE Connectivity PCB Mount Header exemplifies precision engineering, featuring a sleek vertical design ideal for wire-to-board applications. With a natural colour that complements a variety of circuit board aesthetics, this 5-position connector is equipped with a robust, partially shrouded construction ensuring durability and reliable signal transmission. Designed for effortless integration, it accommodates a 2 mm centreline, ensuring compatibility with industry standards. Best suited for demanding applications where space is limited, this connector excels in operational settings with temperatures ranging from -25 to 85 °C. With easy through-hole solder termination, it integrates seamlessly into your circuit design, delivering dependability where it matters most.

Utilises a nylon 66 GF housing material for enhanced durability

Features square contacts for superior mating integrity

Employs kinked tines for secure PCB mount retention

Designed with polarised mating alignment to prevent mismatching

Capable of handling a maximum current of 3 A for reliable functionality

Offers wave solder capability up to 240°C for versatile soldering options

Compliant with stringent RoHS directives for environmentally safe use

Provides packaging in convenient quantities, streamlining assembly processes

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