TE Connectivity AMP HPI Series Vertical Board PCB Header, 5 Contact(s), 2 mm Pitch, 1 Row, Shrouded

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RS-artikelnummer:
477-304
Distrelec artikelnummer:
304-50-777
Tillv. art.nr:
440054-5
Tillverkare / varumärke:
TE Connectivity
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Brand

TE Connectivity

Product Type

PCB Header

Series

AMP HPI

Current

3A

Pitch

2mm

Housing Material

Polyamide 66 Fibreglass

Number of Contacts

5

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Connector System

Wire-to-Board

Mount Type

Board

Contact Plating

Tin Plated

Contact Material

Brass

Termination Type

Solder

Row Pitch

2mm

Minimum Operating Temperature

-25°C

Tail Pin Length

3.4mm

Contact Gender

Male

Maximum Operating Temperature

85°C

Mating Pin Length

3.35mm

Standards/Approvals

No

Voltage

250 V

COO (Country of Origin):
CN
The TE Connectivity PCB Mount Header exemplifies precision engineering, featuring a sleek vertical design ideal for wire-to-board applications. With a natural colour that complements a variety of circuit board aesthetics, this 5-position connector is equipped with a robust, partially shrouded construction ensuring durability and reliable signal transmission. Designed for effortless integration, it accommodates a 2 mm centreline, ensuring compatibility with industry standards. Best suited for demanding applications where space is limited, this connector excels in operational settings with temperatures ranging from -25 to 85 °C. With easy through-hole solder termination, it integrates seamlessly into your circuit design, delivering dependability where it matters most.

Utilises a nylon 66 GF housing material for enhanced durability

Features square contacts for superior mating integrity

Employs kinked tines for secure PCB mount retention

Designed with polarised mating alignment to prevent mismatching

Capable of handling a maximum current of 3 A for reliable functionality

Offers wave solder capability up to 240°C for versatile soldering options

Compliant with stringent RoHS directives for environmentally safe use

Provides packaging in convenient quantities, streamlining assembly processes

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