TE Connectivity AMPMODU Series Board PCB Header, 12 Contact(s), 2.54 mm Pitch, 1 Row, Unshrouded

Antal (1 påse med 90 enheter)*

2 551,09 kr

(exkl. moms)

3 188,86 kr

(inkl. moms)

Add to Basket
välj eller skriv kvantitet
Tillfälligt slut
  • Leverans från den 21 januari 2026
Behöver du mer? Ange den kvantitet du behöver och klicka på "Kontrollera leveransdatum"
Påse(ar)
Per Påse
Per enhet*
1 +2 551,09 kr28,345 kr

*vägledande pris

RS-artikelnummer:
476-770
Tillv. art.nr:
2-87499-1
Tillverkare / varumärke:
TE Connectivity
Hitta liknande produkter genom att välja ett eller flera attribut.
Välj alla

Brand

TE Connectivity

Series

AMPMODU

Product Type

PCB Header

Pitch

2.54mm

Current

3A

Number of Contacts

12

Housing Material

Thermoplastic

Number of Rows

1

Shrouded/Unshrouded

Unshrouded

Mount Type

Board

Connector System

Wire-to-Board

Contact Material

Beryllium Copper Alloy

Termination Type

Crimp

Row Pitch

2.54mm

Minimum Operating Temperature

65°C

Maximum Operating Temperature

105°C

Contact Gender

Female

Standards/Approvals

CSA LR7189, UL 94V-0, UL E28476

Voltage

250 V

Distrelec Product Id

304-55-437

COO (Country of Origin):
MX
The TE Connectivity Housing receptacle for wire-to-board applications delivers a perfect blend of performance and reliability. With its 12-position capacity and crimp-style termination, this product is designed to seamlessly connect wires to PCB layouts requiring compact solutions. Tailored for signal transmission within the AMPMODU IV/V series, it features a 2.54 mm centerline, ensuring compatibility with various PCB designs. Boasting a sleek black thermoplastic body, this housing not only enhances the aesthetic appeal but also ensures durability even in challenging environments. Ideal for diverse industries, it underscores TE Connectivity's commitment to excellence in connector technology, making it a must-have for modern electronic assemblies. This product has been engineered to meet stringent electrical characteristics while ensuring compliance with global standards.

Robust design optimized for wire-to-board connectivity

Inline contact layout enhances signal integrity

Thermoplastic housing material provides exceptional resilience

Compact dimensions facilitate integration into tight spaces

Low termination resistance ensures efficient electrical conduction

relaterade länkar