TE Connectivity AMPMODU Series Vertical Board PCB Header, 8 Contact(s), 2.54 mm Pitch, 1 Row, Unshrouded

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RS-artikelnummer:
476-727
Distrelec artikelnummer:
304-50-890
Tillv. art.nr:
5-146280-8
Tillverkare / varumärke:
TE Connectivity
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Brand

TE Connectivity

Series

AMPMODU

Product Type

PCB Header

Pitch

2.54mm

Current

3A

Housing Material

Liquid Crystal Polymer

Number of Contacts

8

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Connector System

Board-to-Board

Mount Type

Board

Contact Plating

Gold

Contact Material

Copper Alloy

Termination Type

Solder

Row Pitch

2.54mm

Minimum Operating Temperature

65°C

Maximum Operating Temperature

105°C

Standards/Approvals

UL 94 V-0

COO (Country of Origin):
MX
The TE Connectivity PCB Mount Header is designed for vertical board-to-board applications, showcasing unrivalled connectivity for a wide range of electronic devices. Engineered with an 8-position configuration and a 2.54 mm centreline, it ensures dependable signal transmission while maintaining an efficient footprint. The breakaway design facilitates seamless integration into various circuit configurations, while the robust gold-plated contacts contribute to enhanced durability and reliability. Its through-hole solder termination method guarantees a secure connection, making it ideal for demanding environments. With a sleek black finish, this connector not only excels in performance but also complements modern aesthetic designs. Suitable for use in industrial, automotive, and consumer electronics, this product is a versatile choice for engineers and designers alike.

Offers excellent signal integrity for a wide range of applications

Provides a robust and reliable connection with its precision-engineered contacts

Ideal for board-to-board configurations, ensuring seamless integration

Designed to perform within a broad temperature range for versatile application

Low bromine content in materials supports environmental sustainability

Compact design allows for space-efficient placements in circuit boards

Compatible with pin-in-paste assembly processes for enhanced manufacturing flexibility

Meets strict compliance standards for safety and environmental regulations

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