TE Connectivity MICTOR Series Vertical Board PCB Header, 40 Contact(s), 0.8 mm Pitch, Unshrouded

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RS-artikelnummer:
475-090
Distrelec artikelnummer:
304-53-697
Tillv. art.nr:
1658049-1
Tillverkare / varumärke:
TE Connectivity
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Brand

TE Connectivity

Product Type

PCB Header

Series

MICTOR

Pitch

0.8mm

Current

9.5A

Number of Contacts

40

Housing Material

Liquid Crystal Polymer

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Connector System

Board-to-Board

Mount Type

Board

Contact Material

Phosphor Bronze

Contact Plating

Gold Flash

Termination Type

Surface Mount

Minimum Operating Temperature

65°C

Row Pitch

0.8mm

Maximum Operating Temperature

125°C

Standards/Approvals

2016, China RoHS 2 Directive MIIT Order No 32, EU ELV Directive 2000/53/EC Compliant, EU RoHS Directive 2011/65/EU Compliant, UL 94V-0

Voltage

125 V

COO (ursprungsland):
CN
The TE Connectivity PCB mount header is the ideal solution for board-to-board connectivity, designed for reliable performance in varied applications. Crafted to meet the demands of modern electronic assemblies, it supports a high density of 40 positions on a compact 0.8 mm centreline. The robust surface mount design integrates gold flash contact plating to enhance durability and ensure optimum signal integrity. With a versatile vertical orientation, this connector is tailored for power and signal applications, making it suitable for a wide range of industries. Operating under extreme conditions, it maintains performance across a temperature range, ensuring long-term reliability and user confidence. Whether utilised in consumer electronics or industrial equipment, this connector facilitates seamless integration within your designs.

Compact design optimises space usage on PCBs

Gold flash contact plating ensures low contact resistance

Meets stringent electrical performance standards

Robust construction promotes durability in demanding environments

Operating temperature range supports diverse application needs

Designed for straightforward assembly with standardised processes

Features a parallel board-to-board configuration for efficient signal management

Low-profile design enhances compatibility with space-constrained projects

Solder process capability enables excellent heat resistance during installation

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