TE Connectivity MTE Series Vertical Board PCB Header, 14 Contact(s), 0.1 in Pitch, 1 Row, Unshrouded

Antal (1 rör med 70 enheter)*

2 231,26 kr

(exkl. moms)

2 789,08 kr

(inkl. moms)

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RS-artikelnummer:
474-113
Distrelec artikelnummer:
304-53-353
Tillv. art.nr:
1-103635-3
Tillverkare / varumärke:
TE Connectivity
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Brand

TE Connectivity

Series

MTE

Product Type

PCB Header

Pitch

0.1in

Number of Contacts

14

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Mount Type

Board

Connector System

AMPMODU MTE INTERCONNECT SYSTEM

Maximum Operating Temperature

260°C

Standards/Approvals

No

Uppfyller ej RoHS

COO (Country of Origin):
US
The TE Connectivity exceptional product is designed to offer reliable performance in various electronic applications. The precision engineering behind its construction ensures durability and longevity, making it a preferred choice among professionals. Its low halogen content aligns with modern environmental standards, reflecting a commitment to eco-friendliness. With the capability to withstand high temperatures during soldering processes, this product is ideal for use in intricate assemblies where heat resistance is crucial. Moreover, it stands out for its compliance with significant regulatory requirements, providing peace of mind to its users. As part of the MTE HDR SRRA series, this item is tailored to meet the specific needs of demanding environments. Its robust design not only ensures superior functionality but also enhances the overall reliability of end products.

Low halogen formulation underscores commitment to environmental safety

High-temperature reflow solder capability offers versatility in applications

Engineered for compatibility with a range of MTE interconnect systems

Designed to meet rigorous compliance standards for safety and performance

Constructed to provide reliable connectivity in various electrical contexts

Supports easy integration into existing assemblies with minimal adjustments

Distinctive design enhances its durability in challenging environments

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