TE Connectivity AMPMODU Series Right Angle Board PCB Header, 11 Contact(s), 2.54 mm Pitch, 1 Row, Unshrouded

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RS-artikelnummer:
472-839
Distrelec artikelnummer:
304-63-903
Tillv. art.nr:
1-825437-1
Tillverkare / varumärke:
TE Connectivity
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Brand

TE Connectivity

Series

AMPMODU

Product Type

PCB Header

Pitch

2.54mm

Current

5A

Housing Material

Polybutylene Terephthalate

Number of Contacts

11

Number of Rows

1

Orientation

Right Angle

Shrouded/Unshrouded

Unshrouded

Connector System

Board-to-Board

Mount Type

Board

Contact Plating

Gold Flash over Nickel

Contact Material

Brass

Termination Type

Solder

Row Pitch

2.54mm

Minimum Operating Temperature

65°C

Tail Pin Length

3.2mm

Maximum Operating Temperature

105°C

Standards/Approvals

RoHS

Voltage

750 Vrms

COO (Country of Origin):
PL
The TE Connectivity PCB Mount Header is meticulously engineered for seamless board-to-board connectivity, showcasing a right-angle design that optimises space and enhances layout efficiency. With an impressive configuration of 11 positions arranged in a single row, this component is ideal for various applications requiring compact yet reliable interconnections. It features breakaway functionality, allowing for customizable configurations tailored to specific project needs. The header's robust construction from PBT material guarantees durability while ensuring reliable performance across a wide operating temperature range. Designed to be fully loaded, this product is the go-to solution for developers seeking a dependable connector assembly with minimal interference and maximum integrity.

Right-angle orientation allows for efficient use of space on PCBs

Breakaway headers provide flexibility in design and layout

The single row of 11 positions accommodates a variety of wiring needs

Excellent insulation resistance enhances reliability in electrical environments

Compatible with standard PCB thickness, ensuring easy integration

Optimised for a wide operating temperature range from -65 to 105 °C

Utilises nickel underplating for increased durability and reduced wear

Designed to withstand the rigours of wave soldering processes

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