TE Connectivity AMPMODU Series Vertical Through Hole PCB Header, 10 Contact(s), 4.2 mm Pitch, 2 Row, Shrouded

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2 593,28 kr

(exkl. moms)

3 241,60 kr

(inkl. moms)

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RS-artikelnummer:
472-642
Tillv. art.nr:
1-2825272-0
Tillverkare / varumärke:
TE Connectivity
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Brand

TE Connectivity

Product Type

PCB Header

Series

AMPMODU

Current

9A

Pitch

4.2mm

Number of Contacts

10

Housing Material

Polyamide

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Connector System

Wire-to-Board

Mount Type

Through Hole

Contact Plating

Tin Plated

Contact Material

Copper Alloy

Termination Type

Solder

Row Pitch

4.2mm

Minimum Operating Temperature

-40°C

Tail Pin Length

3.5mm

Maximum Operating Temperature

105°C

Standards/Approvals

RoHS

Voltage

60 V

Distrelec Product Id

304-57-969

COO (Country of Origin):
CN
The TE Connectivity PCB Mount Header is engineered for vertical applications, presenting an ideal solution for wire-to-board connections in electronic assemblies. Designed with a 10-position configuration and a centreline of 4.2 mm, this fully shrouded connector ensures secure and reliable interfacing for power applications. Its through-hole solder termination method guarantees stable mechanical support and optimal electrical performance, while the durable polyamide housing provides resistance against environmental factors. The connector is perfectly suited for various industrial applications, enabling streamlined design and increased efficiency.

Fully shrouded design enhances protection against accidental disconnections

High operating voltage rating supports safety in demanding applications

Nickel underplating for improved conductivity and durability

Locking tab ensures a strong, secure mating interface

Optimised for use with PCB thickness up to 1.6 mm for compatibility across devices

Low halogen content complies with environmental standards for safer usage

Efficient packaging quantity reduces waste and ensures sufficient supply

Temperature range accommodates diverse operating environments

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