TE Connectivity AMPMODU Series Vertical Board PCB Header, 16 Contact(s), 2 mm Pitch, 2 Row, Shrouded

Subtotal (1 reel of 700 units)*

26 407,58 kr

(exc. VAT)

33 009,48 kr

(inc. VAT)

Add to Basket
Select or type quantity
Lagerinformation är för närvarande otillgänglig
Reel(s)
Per Reel
Per unit*
1 +26 407,58 kr37,725 kr

*price indicative

RS Stock No.:
472-353
Mfr. Part No.:
1-2307819-6
Brand:
TE Connectivity
Find similar products by selecting one or more attributes.
Select all

Brand

TE Connectivity

Product Type

PCB Header

Series

AMPMODU

Current

2A

Pitch

2mm

Housing Material

Liquid Crystal Polymer

Number of Contacts

16

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Connector System

Board-to-Board

Mount Type

Board

Contact Material

Phosphor Bronze

Contact Plating

Gold

Termination Type

Surface Mount

Minimum Operating Temperature

-40°C

Row Pitch

2mm

Contact Gender

Female

Maximum Operating Temperature

125°C

Standards/Approvals

2016, China RoHS 2 Directive MIIT Order No 32, EU ELV Directive 2000/53/EC Compliant, EU RoHS Directive 2011/65/EU Compliant, UL 94V-0

Voltage

125 V

Distrelec Product Id

304-53-455

COO (Country of Origin):
CN
The TE Connectivity PCB Mount Receptacle is a versatile and reliable solution for your electronic interconnection needs. Designed with a vertical orientation, this connector accommodates 16 positions, ensuring a secure and efficient board-to-board connection. Crafted with a gold (Au) finish for superior conductivity, this surface mount receptacle excels in providing seamless signal transmission for a range of applications. The compact design, featuring a standard connector profile, incorporates innovative materials such as liquid crystal polymer for enhanced durability and performance under various environmental conditions.

Engineered for board-to-board applications, enhancing connectivity options

The compact design minimises space consumption on printed circuit boards

Robust construction ensures reliable performance in high-temperature settings

Utilises gold plating to improve electrical conductivity and reduce signal loss

Tailored for surface mount technology, supporting streamlined assembly processes

Offers a dual-row layout facilitating efficient circuit design and maximising performance

Features an operating temperature range suitable for diverse environmental conditions

Incorporates nickel underplating for additional protection and longevity

Related links