TE Connectivity AMPMODU Series Vertical Board PCB Header, 18 Contact(s), 2.54 mm Pitch, 2 Row, Unshrouded

Antal (1 förpackning med 25 enheter)*

2 445,25 kr

(exkl. moms)

3 056,56 kr

(inkl. moms)

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1 +2 445,25 kr97,81 kr

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RS-artikelnummer:
472-071
Distrelec artikelnummer:
304-64-103
Tillv. art.nr:
5-103233-8
Tillverkare / varumärke:
TE Connectivity
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Brand

TE Connectivity

Product Type

PCB Header

Series

AMPMODU

Current

3A

Pitch

2.54mm

Number of Contacts

18

Housing Material

Thermoplastic

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Mount Type

Board

Connector System

Board-to-Board

Contact Plating

Gold

Contact Material

Copper Alloy

Termination Type

Solder

Row Pitch

2.54mm

Tail Pin Length

6.35mm

Standards/Approvals

CSA LR7189, UL E28476

Voltage

750 Vrms

COO (Country of Origin):
MX
The TE Connectivity PCB Mount Header is engineered to facilitate efficient board-to-board connections, offering robust performance for various electronic applications. Its unique unshrouded design allows for easy mating and alignment in confined spaces, making it an ideal choice for compact electronic assemblies. With a vertical mount orientation, this connector supports an 18-position and 2-row configuration, ensuring versatility in design. Constructed from high-quality thermoplastic with a reliable nickel underplating, it not only withstands high operational temperatures but also provides durability for long-term use. The header's compatibility with multiple standards highlights its reliability, making it a preferred solution among engineers seeking integration in complex systems.

Unshrouded design allows for easier alignment and mating

Vertical orientation optimises space efficiency in electronic applications

Constructed from durable thermoplastic to endure high temperatures

Nickel underplating enhances connection reliability and longevity

Designed to meet various industry standards for compatibility

Robust contact rating supports maximum current loading capabilities

Efficient packaging method reduces shipping waste and environmental impact

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