TE Connectivity AMPMODU Series Right Angle Board PCB Header, 24 Contact(s), 2.54 mm Pitch, 2 Row, Shrouded

Antal (1 rör med 24 enheter)*

2 352,50 kr

(exkl. moms)

2 940,62 kr

(inkl. moms)

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1 +2 352,50 kr98,021 kr

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RS-artikelnummer:
472-067
Distrelec artikelnummer:
304-54-122
Tillv. art.nr:
5-102589-6
Tillverkare / varumärke:
TE Connectivity
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Brand

TE Connectivity

Product Type

PCB Header

Series

AMPMODU

Current

3A

Pitch

2.54mm

Number of Contacts

24

Housing Material

Thermoplastic

Number of Rows

2

Orientation

Right Angle

Shrouded/Unshrouded

Shrouded

Connector System

Board-to-Board

Mount Type

Board

Contact Plating

Gold

Contact Material

Phosphor Bronze

Termination Type

Solder

Row Pitch

2.54mm

Minimum Operating Temperature

65°C

Maximum Operating Temperature

105°C

Tail Pin Length

3.18mm

Standards/Approvals

CSA LE7189, UL E28476

Voltage

250 V

COO (Country of Origin):
MX
The TE Connectivity PCB Mount Header is designed for seamless integration in board-to-board applications, ensuring reliable connectivity. With a right angle orientation and 24 position capacity, this component is ideal for a wide range of electronic assemblies. Its partially shrouded design offers a balance of accessibility and protection, making it well-suited for various environments. Crafted from high-quality materials, this header guarantees durability and longevity while handling operational voltages of up to 250 VAC. The combination of its gold-plated contacts and phosphor bronze contact base further enhances its performance, ensuring secure and efficient connections.

Right angle orientation facilitates space-saving layouts

Partially shrouded design boosts reliability during mating

24 positions cater to versatile connection needs

Constructed from thermoplastic for enhanced durability

Square post design allows for secure seating and stability

Wave solder capable to 240°C for robust assembly processes

Phosphor bronze contact base ensures excellent conductivity

Compatible with various TE part numbers for expanded applications

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