Molex 503308 Series Vertical Surface PCB Header, 44 Contact(s), 0.4 mm Pitch, 2 Row, Unshrouded

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59 073,40 kr

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73 841,75 kr

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RS-artikelnummer:
472-009
Distrelec artikelnummer:
304-62-353
Tillv. art.nr:
503308-4410
Tillverkare / varumärke:
Molex
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Brand

Molex

Series

503308

Product Type

PCB Header

Current

0.3A

Pitch

0.4mm

Number of Contacts

44

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Mount Type

Surface

Contact Plating

Gold

Contact Material

Copper Alloy

Minimum Operating Temperature

-20°C

Termination Type

Surface Mount

Row Pitch

0.4mm

Maximum Operating Temperature

85°C

Contact Gender

Male

Standards/Approvals

REACH, RoHS

Voltage

50 V

COO (ursprungsland):
JP
The TE Connectivity board-to-board connector is designed to deliver exceptional reliability and performance for modern electronic applications. With a slim 0.40mm pitch, this connector ensures a compact footprint while maintaining robust functionality. It is tailored for surface mount technology, featuring dual rows that facilitate vertical stacking with precise alignment. The connector boasts a stacking height option of 0.70mm or 1.00mm, accommodating various design constraints. Built with copper alloy and gold plating, it ensures optimal conductivity and durability, making it suitable for harsh environments. The product is compliant with RoHS and REACH regulations, confirming its adherence to environmental standards, which is critical for manufacturers looking to meet global compliance requirements. Overall, this connector combines innovation with high performance, ensuring it meets the demands of contemporary electronic systems.

Compact design enhances space utilisation in electronic assemblies

Optimised for seamless integration with board-to-board applications

Durable construction ensures long-lasting performance under varying conditions

Dual row configuration provides enhanced connectivity options

Meets international compliance standards, ensuring environmental responsibility

Gold-plated contacts prevent corrosion and ensure reliable connectivity

Suitable for high-density applications with 44 circuits maximum capacity

Vertical orientation simplifies layout and design processes

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