TE Connectivity AMPMODU Series Vertical Board PCB Header, 34 Contact(s), 2.54 mm Pitch, 2 Row, Shrouded

Se alla PCB Headers

Antal (1 fack med 20 enheter)*

2 379,78 kr

(exkl. moms)

2 974,72 kr

(inkl. moms)

Add to Basket
välj eller skriv kvantitet
Tillfälligt slut
  • Leverans från den 21 januari 2026
Behöver du mer? Ange den kvantitet du behöver och klicka på "Kontrollera leveransdatum"
Bricka(or)
Per Bricka
Per enhet*
1 +2 379,78 kr118,989 kr

*vägledande pris

RS-artikelnummer:
471-377
Tillv. art.nr:
1-103169-5
Tillverkare / varumärke:
TE Connectivity
Hitta liknande produkter genom att välja ett eller flera attribut.
Välj alla

Brand

TE Connectivity

Product Type

PCB Header

Series

AMPMODU

Current

3A

Pitch

2.54mm

Housing Material

Thermoplastic

Number of Contacts

34

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Board

Connector System

Board-to-Board

Contact Material

Phosphor Bronze

Contact Plating

Gold

Row Pitch

2.54mm

Minimum Operating Temperature

65°C

Termination Type

Solder

Maximum Operating Temperature

105°C

Tail Pin Length

3.18mm

Standards/Approvals

CSA LR7189, UL 94V-0, UL E28476

Voltage

750 Vrms

Distrelec Product Id

304-48-102

Uppfyller ej RoHS

COO (Country of Origin):
MX
The TE Connectivity PCB Mount Header is a versatile and robust solution designed for vertical board-to-board connections. Engineered with 34 positions and a compact 2.54 mm centerline, this fully shrouded connector ensures secure and reliable signal transmission in a variety of applications. Its gold-plated contacts provide excellent conductivity, while the durable thermoplastic housing withstands demanding environments. The connector is specifically designed for through-hole soldering, facilitating a seamless integration into printed circuit boards. Ideal for use in automotive, communication, and industrial applications, this connector simplifies connectivity while maintaining superior performance and longevity.

Fully shrouded design provides enhanced protection against misalignment and damage

Parallel board-to-board configuration accommodates space-constrained designs

Robust construction ensures durability in harsh operating conditions

Mating alignment is facilitated by built-in polarization features

Compatible with a wide range of applications for flexible integration

Wave solder capable, allowing for quick and efficient assembly

relaterade länkar