TE Connectivity 1-111 Series Vertical Board PCB Header, 5 Contact(s), 3.96 mm Pitch, 1 Row, Shrouded

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2 799,10 kr

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3 498,88 kr

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RS-artikelnummer:
471-341
Tillv. art.nr:
1-1123723-5
Tillverkare / varumärke:
TE Connectivity
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Brand

TE Connectivity

Product Type

PCB Header

Series

1-111

Pitch

3.96mm

Current

8A

Number of Contacts

5

Housing Material

Fibreglass Reinforced Polybutylene Terephthalate

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Board

Connector System

Wire-to-Board

Contact Plating

Tin Plated

Contact Material

Brass

Minimum Operating Temperature

30°C

Row Pitch

3.96mm

Termination Type

Solder

Tail Pin Length

3.7mm

Maximum Operating Temperature

105°C

Mating Pin Length

7.7mm

Standards/Approvals

UL 94V-0, UL Rating Recognised

Voltage

250 V

Distrelec Product Id

304-52-344

COO (ursprungsland):
CN
The TE Connectivity PCB Mount Header is designed for vertical wire-to-board connections in applications that require reliability and performance. Engineered with a strong 5-position configuration and featuring a partially shrouded header type, this connector guarantees seamless integration into various circuit designs. The robust housing, made from durable PBT GF material, ensures excellent thermal stability up to 105 °C, while the tin-plated contacts provide reliable conductivity for power transfer. The 3.96 mm centerline design enhances space efficiency in dense PCB layouts, allowing for effortless installation and maintenance. Emphasizing quality, this connector is compliant with several industry standards, assuring its suitability across a multitude of applications in electronics.

Designed for wire-to-board configurations for efficient connectivity

Features half-shrouded design to enhance safety and reliability

Offers a robust connector profile for added durability in applications

Supports a wide operating voltage range for versatile usage

Utilizes nickel and tin underplating for optimal electrical performance

Facilitates easy board mounting with minimal alignment concerns

Proven to withstand high-temperature environments, extending its application lifecycle

Provided in high packaging quantities, ensuring supply readiness

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