TE Connectivity Free Height Series Vertical Surface PCB Header, 64 Contact(s), 1 mm Pitch, 32 Row, Shrouded

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55 833,57 kr

(exkl. moms)

69 791,96 kr

(inkl. moms)

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RS-artikelnummer:
471-013
Tillv. art.nr:
1-146897-1
Tillverkare / varumärke:
TE Connectivity
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Brand

TE Connectivity

Series

Free Height

Product Type

PCB Header

Pitch

1mm

Current

1A

Housing Material

Matt

Number of Contacts

64

Number of Rows

32

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Surface

Connector System

Board-to-Board

Contact Material

Phosphor Bronze

Contact Plating

Gold

Termination Type

Surface Mount

Row Pitch

1mm

Minimum Operating Temperature

-55°C

Maximum Operating Temperature

110°C

Standards/Approvals

CSA, IEEE 1386, UL, UL 94V-0

Voltage

250 V

Distrelec Product Id

304-53-370

COO (Country of Origin):
CN
The TE Connectivity PCB Mount Header is a high-performance connector designed for vertical board-to-board applications, ideal for use in signal processing. Engineered with a robust 64-position configuration and a precise 1 mm centreline, this fully shrouded component ensures optimal connectivity and stability in demanding environments. The header features gold-plated contacts that enhance signal integrity while reducing contact resistance. Its surface mount design facilitates easy assembly, making it suitable for automated pick and place assembly processes. With a temperature operating range from -55 to 110°C, this connector is built to withstand harsh conditions, ensuring long-lasting performance and reliability in various applications. The product’s compact dimensions further contribute to efficient space utilisation on printed circuit boards, streamlining overall design while meeting industry standards.

Designed for vertical board to board configurations

64 positions enable extensive connectivity options

Gold plated contacts enhance conductivity and reduce wear

Suitable for automated manufacturing processes

Low halogen content supports eco friendly initiatives

Stackable design provides flexibility in multi layered applications

Signal integrity is maintained through sophisticated engineering

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