TE Connectivity CHAMP .050 Series Vertical Board PCB Header, 80 Contact(s), 1.27 mm Pitch, 1 Row, Shrouded

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3 228,51 kr

(exkl. moms)

4 035,64 kr

(inkl. moms)

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RS-artikelnummer:
469-675
Distrelec artikelnummer:
304-54-230
Tillv. art.nr:
5176372-3
Tillverkare / varumärke:
TE Connectivity
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Brand

TE Connectivity

Product Type

PCB Header

Series

CHAMP .050

Pitch

1.27mm

Current

1A

Number of Contacts

80

Housing Material

Nylon Fibreglass

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Board

Connector System

Board-to-Board

Contact Material

Phosphor Bronze

Contact Plating

Gold

Termination Type

Solder

Row Pitch

1.27mm

Minimum Operating Temperature

-55°C

Contact Gender

Female

Maximum Operating Temperature

85°C

Tail Pin Length

3.2mm

Standards/Approvals

UL 94 V-0

Voltage

250 V

COO (Country of Origin):
JP
The TE Connectivity PCB Mount Receptacle is meticulously designed for vertical, board-to-board applications, providing unparalleled reliability in compact spaces. Renowned for its robustness, the receptacle accommodates up to 80 positions with a 1.27 mm centreline, making it an ideal choice for dense circuit designs. The high-quality gold-plated contacts ensure exceptional conductivity and durability, while the through-hole solder termination method guarantees a secure connection during assembly. Built with nylon glass-filled housing, this component is not only lightweight but also offers superior thermal stability, capable of withstanding temperatures ranging from -55 to 85 °C. This product exemplifies innovation in connector technology, embodying seamless integration with your electronic systems while offering ease in handling and assembly.

Utilises a square contact shape for enhanced reliability in electrical connections

Employs robust nylon housing for added durability and heat resistance

Meets strict UL flammability standards for safety assurance

Provides compliance with multiple environmental directives, assuring eco-friendly use

Offers a tray packaging method for efficient bulk handling and logistics

Designed to cater to a variety of applications, reinforcing versatility

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