TE Connectivity 51762 Series Vertical Board PCB Header, 8 Contact(s), 2 mm Pitch, 2 Row, Unshrouded

Subtotal (1 pack of 120 units)*

2 362,98 kr

(exc. VAT)

2 953,72 kr

(inc. VAT)

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  • Leverans från den 22 januari 2026
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Pack(s)
Per Pack
Per unit*
1 +2 362,98 kr19,692 kr

*price indicative

RS Stock No.:
469-672
Mfr. Part No.:
5176264-3
Brand:
TE Connectivity
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Brand

TE Connectivity

Product Type

PCB Header

Series

51762

Pitch

2mm

Current

1A

Number of Contacts

8

Housing Material

Thermoplastic

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Mount Type

Board

Connector System

Board-to-Board

Contact Material

Brass

Contact Plating

Gold

Termination Type

Solder

Row Pitch

2mm

Minimum Operating Temperature

-40°C

Contact Gender

Male

Maximum Operating Temperature

105°C

Tail Pin Length

2.6mm

Mating Pin Length

4mm

Standards/Approvals

No

Voltage

200 V

Distrelec Product Id

304-54-227

COO (Country of Origin):
SG
The TE Connectivity PCB Mount Header is an advanced interconnection solution designed for efficient board-to-board communication in electronic applications. Featuring a vertical orientation and unshrouded design, this component ensures easy access for mating. Engineered for an optimal 2 mm centreline, it accommodates up to 8 positions in a compact layout, making it ideal for space-constrained projects. The robust construction with gold plating provides reliable signal transmission, while the through-hole solder termination method guarantees secure mounting on printed circuit boards. With its high performance and excellent durability, this header is a preferred choice for designing reliable electronic systems.

Designed for straightforward integration into various PCB layouts

Ensures reliable connections for signal applications

Made from thermoplastic housing for enhanced resistance

Offers an operating temperature range that supports diverse applications

Compatible with multiple industry standards for universal usage

Facilitates a wave soldering process, making assembly efficient

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