TE Connectivity AMPMODU Series Vertical Board PCB Header, 8 Contact(s), 2.54 mm Pitch, 1 Row, Shrouded

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3 027,67 kr

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RS-artikelnummer:
468-983
Distrelec artikelnummer:
304-50-571
Tillv. art.nr:
215299-8
Tillverkare / varumärke:
TE Connectivity
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Brand

TE Connectivity

Product Type

PCB Header

Series

AMPMODU

Current

3A

Pitch

2.54mm

Number of Contacts

8

Housing Material

Fibreglass Polyester

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Board

Connector System

Board-to-Board

Contact Material

Phosphor Bronze

Contact Plating

Gold

Row Pitch

2.54mm

Minimum Operating Temperature

65°C

Termination Type

Solder

Tail Pin Length

3.1mm

Maximum Operating Temperature

125°C

Standards/Approvals

UL 94 V-0

COO (Country of Origin):
PL
The TE Connectivity PCB Mount Receptacle is an essential component designed for seamless board-to-board connections. Engineered with an 8-position configuration and a 2.54 mm centreline, this fully shrouded connector guarantees robust performance in various applications. Its vertical orientation simplifies the PCB layout while ensuring efficient space utilisation. The gold plating enhances conductivity, delivering superior electrical performance while maintaining reliable mechanical strength. Ideal for both general and specialised electronic applications, this receptacle boasts durability along with an elegant aesthetic, making it a perfect choice for modern designs. With a temperature tolerance ranging from -65 to 125 °C, it is suitable for a wide range of environments, ensuring consistent functionality and longevity.

Designed for easy PCB integration with a top mating entry location

Constructed from high-quality polyester reinforced with glass fibres for durability

Offers a standard connector profile for versatile mounting options

Has a retention type that ensures secure solder tail connections

Features a closed entry housing for enhanced contact protection

Solder process compatible, optimising assembly efficiency with wave soldering capabilities

Compliant with multiple international directives, ensuring environmental safety standards

Supports stackable configurations, facilitating space-saving designs

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