TE Connectivity AMPMODU PCB Headers & Receptacles Series Vertical Board PCB Header, 20 Contact(s), 1.27 mm Pitch, 2 Row,

Antal (1 rulle med 300 enheter)*

22 071,40 kr

(exkl. moms)

27 589,25 kr

(inkl. moms)

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RS-artikelnummer:
467-230
Distrelec artikelnummer:
304-53-678
Tillv. art.nr:
147378-2
Tillverkare / varumärke:
TE Connectivity
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Brand

TE Connectivity

Series

AMPMODU PCB Headers & Receptacles

Product Type

PCB Header

Pitch

1.27mm

Current

3.6A

Number of Contacts

20

Housing Material

Polyphthalamide

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Connector System

Board-to-Board

Mount Type

Board

Contact Material

Phosphor Bronze

Contact Plating

Gold

Minimum Operating Temperature

65°C

Termination Type

Surface Mount

Row Pitch

1.27mm

Maximum Operating Temperature

105°C

Contact Gender

Female

Standards/Approvals

CSA LR7189, UL 94V-0, UL E28476

Voltage

30 V

Uppfyller ej RoHS

COO (Country of Origin):
MX
The TE Connectivity PCB Mount Receptacle is an integral component for board-to-board connections, designed to facilitate efficient signal transmissions. Its unique configuration features 20 positions and a vertical PCB mount orientation, ensuring solid alignment and compact integration into your electronic assemblies. With robust electrical characteristics, including an operating voltage of 30 VAC and excellent insulation resistance, this connector provides reliable performance under diverse operational conditions. Additionally, the device boasts a durable housing material designed to withstand various environmental challenges. This product exemplifies the commitment to quality and functionality expected from industry-leading manufacturers.

Designed for seamless integration into electronic assemblies

Offers a reliable connection for board-to-board applications

Features excellent insulation properties for enhanced safety

Provides a compact design with efficient use of space

Facilitates easy assembly with its surface mount termination method

Constructed with resilient materials to withstand temperature variations

Compatible with industry standards, ensuring broader application suitability

Optimised for reflow solder processes, enhancing assembly efficiency

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