TE Connectivity AMPMODU MTE Series Vertical Surface PCB Header, 4 Contact(s), 2.54 mm Pitch, 1 Row, Shrouded

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3 375,61 kr

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4 219,51 kr

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RS-artikelnummer:
467-208
Distrelec artikelnummer:
304-53-664
Tillv. art.nr:
1375549-3
Tillverkare / varumärke:
TE Connectivity
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Brand

TE Connectivity

Product Type

PCB Header

Series

AMPMODU MTE

Current

3A

Pitch

2.54mm

Number of Contacts

4

Housing Material

Thermoplastic

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Surface

Connector System

Wire-to-Board

Contact Plating

Tin Lead

Contact Material

Brass

Minimum Operating Temperature

65°C

Row Pitch

2.54mm

Termination Type

Surface Mount

Maximum Operating Temperature

105°C

Standards/Approvals

CSA LR7189, UL 94V-0, UL E28476

Voltage

250 V

Uppfyller ej RoHS

COO (Country of Origin):
MX
The TE Connectivity pcb mount header is designed for vertical wire-to-board applications, featuring a robust, fully shrouded configuration. With a 4-position layout and 2.54 mm centreline, this connector ensures secure electrical connections, making it ideal for various electronic devices. Constructed from durable materials, it combines functionality with a compact design, effectively optimising space on printed circuit boards. The black thermoplastic housing not only enhances aesthetic appeal but also guarantees reliability in demanding environments, where temperatures can range from -65 to 105 °C. This product is particularly suitable for signal applications and has been developed with meticulous attention to detail to ensure compatibility and performance consistency across a wide range of industrial standards.

Versatile mounting options for enhanced application compatibility

Seamless pick-and-place assembly feature simplifies installation

Mating alignment is facilitated through latched and polarised designs

Designed for surface mounting, saving valuable PCB real estate

Operating voltage capability caters to diverse electrical requirements

Robust body material ensures durability under high-temperature conditions

Excellent mating retention properties enhance connection stability

Plating materials are carefully selected for optimal conductivity and corrosion resistance

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