TE Connectivity AMPMODU MTE Series Vertical Surface PCB Header, 4 Contact(s), 2.54 mm Pitch, 1 Row, Shrouded

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3 375,61 kr

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4 219,51 kr

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RS-artikelnummer:
467-208
Tillv. art.nr:
1375549-3
Tillverkare / varumärke:
TE Connectivity
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Brand

TE Connectivity

Series

AMPMODU MTE

Product Type

PCB Header

Current

3A

Pitch

2.54mm

Housing Material

Thermoplastic

Number of Contacts

4

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Connector System

Wire-to-Board

Mount Type

Surface

Contact Plating

Tin Lead

Contact Material

Brass

Termination Type

Surface Mount

Row Pitch

2.54mm

Minimum Operating Temperature

65°C

Maximum Operating Temperature

105°C

Standards/Approvals

CSA LR7189, UL 94V-0, UL E28476

Voltage

250 V

Distrelec Product Id

304-53-664

Uppfyller ej RoHS

COO (ursprungsland):
MX
The TE Connectivity pcb mount header is designed for vertical wire-to-board applications, featuring a robust, fully shrouded configuration. With a 4-position layout and 2.54 mm centreline, this connector ensures secure electrical connections, making it ideal for various electronic devices. Constructed from durable materials, it combines functionality with a compact design, effectively optimising space on printed circuit boards. The black thermoplastic housing not only enhances aesthetic appeal but also guarantees reliability in demanding environments, where temperatures can range from -65 to 105 °C. This product is particularly suitable for signal applications and has been developed with meticulous attention to detail to ensure compatibility and performance consistency across a wide range of industrial standards.

Versatile mounting options for enhanced application compatibility

Seamless pick-and-place assembly feature simplifies installation

Mating alignment is facilitated through latched and polarised designs

Designed for surface mounting, saving valuable PCB real estate

Operating voltage capability caters to diverse electrical requirements

Robust body material ensures durability under high-temperature conditions

Excellent mating retention properties enhance connection stability

Plating materials are carefully selected for optimal conductivity and corrosion resistance

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