Molex MicroClasp Series Straight Through Hole PCB Header, 4 Contact(s), 2 mm Pitch, 1 Row, Shrouded

Antal (1 förpackning med 10 enheter)*

50,41 kr

(exkl. moms)

63,01 kr

(inkl. moms)

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  • Dessutom levereras 200 enhet(er) från den 22 december 2025
  • Dessutom levereras 70 enhet(er) från den 22 december 2025
  • Dessutom levereras 410 enhet(er) från den 29 december 2025
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Per förpackning*
10 +5,041 kr50,41 kr

*vägledande pris

Förpackningsalternativ:
RS-artikelnummer:
188-103
Tillv. art.nr:
55932-0410
Tillverkare / varumärke:
Molex
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Brand

Molex

Product Type

PCB Header

Series

MicroClasp

Current

3A

Pitch

2mm

Number of Contacts

4

Housing Material

Polyester

Number of Rows

1

Orientation

Straight

Shrouded/Unshrouded

Shrouded

Connector System

Wire-to-Board

Mount Type

Through Hole

Contact Plating

Tin

Contact Material

Tin

Termination Type

Solder

Minimum Operating Temperature

-40°C

Row Pitch

2mm

Tail Pin Length

3.2mm

Maximum Operating Temperature

105°C

Contact Gender

Male

Standards/Approvals

No

Mating Pin Length

2mm

Voltage

250 V

Distrelec Product Id

304-57-502

COO (Country of Origin):
JP

Single Row Vertical Header with Boss


A range of 2.00mm Pitch MicroClasp™ Wire-to-Board Headers with Boss.

2.0mm Wire to Board - Molex MicroClasp™ Range


MicroClasp™ 2.00mm pitch Wire to Board system provides space savings and easy mating/unmating compared to similar 2.00mm and 2.50mm pitch Wire to Board systems. MicroClasp™ includes a unique inner positive lock that provides latch protection, secure retention and an audible mating click. The Terminal design of the MicroClasp™ series offers low insertion and withdrawal forces and is able to carry 3.0 A current in a Compact 2.00mm pitch design.

2.00mm (0.079”) Pitch

Inner Positive Lock

Low insertion force Terminal design

Two-point contact design

High-current contact design

Housing lance system

PCB space savings

Latch protection/secure mating/audible “click”

Easy mating/unmating

Carry up to 3.0A

Terminal protection and secure retention

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