TDK 1nF Multilayer Ceramic Capacitor MLCC, 50V dc V, ±10% , SMD
- RS-artikelnummer:
- 179-5576
- Tillv. art.nr:
- CGA3E2X7R1H102K080AE
- Tillverkare / varumärke:
- TDK
Mängdrabatt möjlig
Antal (1 rulle med 500 enheter)*
255,50 kr
(exkl. moms)
319,50 kr
(inkl. moms)
GRATIS leverans för online beställningar över 500,00 kr
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- 1 500 enhet(er) är redo att levereras
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Enheter | Per enhet | Per rulle* |
|---|---|---|
| 500 - 1500 | 0,511 kr | 255,50 kr |
| 2000 + | 0,466 kr | 233,00 kr |
*vägledande pris
- RS-artikelnummer:
- 179-5576
- Tillv. art.nr:
- CGA3E2X7R1H102K080AE
- Tillverkare / varumärke:
- TDK
Specifikationer
Datablad
Lagstiftning och ursprungsland
Produktdetaljer
Hitta liknande produkter genom att välja ett eller flera attribut.
Välj alla | Attribut | Värde |
|---|---|---|
| Brand | TDK | |
| Capacitance | 1nF | |
| Voltage | 50V dc | |
| Package/Case | 0603 (1608M) | |
| Mounting Type | Surface Mount | |
| Dielectric | X7R | |
| Tolerance | ±10% | |
| Dimensions | 1.6 x 0.8 x 0.8mm | |
| Length | 1.6mm | |
| Automotive Standard | AEC-Q200 | |
| Depth | 0.8mm | |
| Height | 0.8mm | |
| Series | CGA | |
| Maximum Operating Temperature | +125°C | |
| Suppression Class | Class 2 | |
| Minimum Operating Temperature | -55°C | |
| Välj alla | ||
|---|---|---|
Brand TDK | ||
Capacitance 1nF | ||
Voltage 50V dc | ||
Package/Case 0603 (1608M) | ||
Mounting Type Surface Mount | ||
Dielectric X7R | ||
Tolerance ±10% | ||
Dimensions 1.6 x 0.8 x 0.8mm | ||
Length 1.6mm | ||
Automotive Standard AEC-Q200 | ||
Depth 0.8mm | ||
Height 0.8mm | ||
Series CGA | ||
Maximum Operating Temperature +125°C | ||
Suppression Class Class 2 | ||
Minimum Operating Temperature -55°C | ||
- COO (Country of Origin):
- JP
TDK multilayer ceramic chip capacitor_Soft termination_Automotive grade_CGA series is a product which conductive resin layers are included in terminations. Soft termination series has higher mechanical endurance by the flexible resin layers which absorbs thermal and mechanical stress.
FEATURES
Higher mechanical endurance is realized by flexible resin layers.
X8R type which maximum temperature is up to 150°C is applicable.
C0G temperature characteristic which has excellent stable temperature and DC-bias characteristics is applicable.
APPLICATIONS
Fail-safe design in battery line.
Prevention of ceramic body cracks by board bending.
Prevention of solder cracks by thermal shock.
The set having a high probability of fall such as keyless entry and
Smart-key
Higher mechanical endurance is realized by flexible resin layers.
X8R type which maximum temperature is up to 150°C is applicable.
C0G temperature characteristic which has excellent stable temperature and DC-bias characteristics is applicable.
APPLICATIONS
Fail-safe design in battery line.
Prevention of ceramic body cracks by board bending.
Prevention of solder cracks by thermal shock.
The set having a high probability of fall such as keyless entry and
Smart-key
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