TDK 100nF Multilayer Ceramic Capacitor MLCC, 630V dc V, ±20% , SMD
- RS-artikelnummer:
- 179-5538
- Tillv. art.nr:
- CGA6L1X7T2J104M160AE
- Tillverkare / varumärke:
- TDK
Mängdrabatt möjlig
Antal (1 förpackning med 25 enheter)*
108,10 kr
(exkl. moms)
135,125 kr
(inkl. moms)
GRATIS leverans för online beställningar över 500,00 kr
I lager
- 175 enhet(er) är redo att levereras
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Enheter | Per enhet | Per förpackning* |
|---|---|---|
| 25 - 75 | 4,324 kr | 108,10 kr |
| 100 - 225 | 4,207 kr | 105,18 kr |
| 250 - 475 | 4,09 kr | 102,25 kr |
| 500 - 1225 | 3,983 kr | 99,58 kr |
| 1250 + | 3,884 kr | 97,10 kr |
*vägledande pris
- RS-artikelnummer:
- 179-5538
- Tillv. art.nr:
- CGA6L1X7T2J104M160AE
- Tillverkare / varumärke:
- TDK
Specifikationer
Datablad
Lagstiftning och ursprungsland
Produktdetaljer
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Välj alla | Attribut | Värde |
|---|---|---|
| Brand | TDK | |
| Capacitance | 100nF | |
| Voltage | 630V dc | |
| Package/Case | 1210 (3225M) | |
| Mounting Type | Surface Mount | |
| Dielectric | X7T | |
| Tolerance | ±20% | |
| Dimensions | 3.2 x 2.5 x 1.6mm | |
| Length | 3.2mm | |
| Automotive Standard | AEC-Q200 | |
| Depth | 2.5mm | |
| Height | 1.6mm | |
| Series | CGA | |
| Maximum Operating Temperature | +125°C | |
| Minimum Operating Temperature | -55°C | |
| Suppression Class | Class 2 | |
| Välj alla | ||
|---|---|---|
Brand TDK | ||
Capacitance 100nF | ||
Voltage 630V dc | ||
Package/Case 1210 (3225M) | ||
Mounting Type Surface Mount | ||
Dielectric X7T | ||
Tolerance ±20% | ||
Dimensions 3.2 x 2.5 x 1.6mm | ||
Length 3.2mm | ||
Automotive Standard AEC-Q200 | ||
Depth 2.5mm | ||
Height 1.6mm | ||
Series CGA | ||
Maximum Operating Temperature +125°C | ||
Minimum Operating Temperature -55°C | ||
Suppression Class Class 2 | ||
- COO (Country of Origin):
- JP
TDK multilayer ceramic chip capacitor_Soft termination_Automotive grade_CGA series is a product which conductive resin layers are included in terminations. Soft termination series has higher mechanical endurance by the flexible resin layers which absorbs thermal and mechanical stress.
FEATURES
Higher mechanical endurance is realized by flexible resin layers.
X8R type which maximum temperature is up to 150°C is applicable.
C0G temperature characteristic which has excellent stable temperature and DC-bias characteristics is applicable.
APPLICATIONS
Fail-safe design in battery line.
Prevention of ceramic body cracks by board bending.
Prevention of solder cracks by thermal shock.
The set having a high probability of fall such as keyless entry and
Smart-key
Higher mechanical endurance is realized by flexible resin layers.
X8R type which maximum temperature is up to 150°C is applicable.
C0G temperature characteristic which has excellent stable temperature and DC-bias characteristics is applicable.
APPLICATIONS
Fail-safe design in battery line.
Prevention of ceramic body cracks by board bending.
Prevention of solder cracks by thermal shock.
The set having a high probability of fall such as keyless entry and
Smart-key
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